Other machines for the electronics industry

Flawless bonding, drying and transport. The Double Facer from BHS Corrugated does it all – from micro-flute to heavy triple-corrugated board. How productive your corrugator is largely depends on the performance of your Double Facer, especially ...

Hand-Held Systems for Ultrasonic Plastic Bonding & Cutting Hand-held welding and cutting units allow for exceptional control and accuracy Ideal for cutting and bonding delicate plastic components, lightweight synthetics, nonwovens ...

The Nex Flow™ Ion Blaster Beam™ neutralizes static electricity and can remove static charge on a statically charged part and blow off dust up to 15 feet (4.6 m) away with no moving parts. Its compact design allows it to be used in hard ...

APPLICATIONS The semi-automatic Cap Bonding System CBS 15 fastens threaded end pieces on to the clip-pak® packaging units, which can be afterwards manually fitted with extrusion nozzles and closures (e.g. end caps, pegboard/Euro hanger ...

This equipment is used for general glass, special-shaped glass. The main functions are as follows: 1) After discharge of the COG Bonding device;2) A device with Edge Clean (option), ACF attachment, FPC (COF) false pressure and FPC (COF) ...

Logitech’s WSBU Wafer Substrate Bonding Units are premium bonders for the processing of fragile semiconductor wafers such as silicon and gallium arsenide. The bonding units are designed to minimise breakage with these expensive materials, ...

Maximum cutting height: 305 mm
Tube diameter: 305 mm
Cutting speed: 20, 35 m/s

The DW292-300 is specifically designed for slicing monocrystalline silicon blocks with up to 300mm diameter into high quality wafers for the semiconductor industry. The new developed DW292-300 is capable to be run with slurry as well ...

Radyne brand ammunition annealing and bonding systems are used to make bullets for law enforcement and military applications, as well as for the hunting and shooting enthusiast. Radyne brand has a well-established history of designing ...

RENA’s wet etching tool for caustic or acidic applications is built to achieve outstanding surface results in semiconductor wafer production. Acidic etching combined with a fast transport system enables precise process control. For ...

Manual electroplating line 1、Scope of application Small and integrated wastewater treatment equipment, waste gas treatment device, precious metal recovery device, electroplating wastewater reuse "zero discharge" system, special ...

X travel: 2,600 mm - 3,600 mm
Y travel: 1,500 mm

The 6-axis technology allows complex components to be machined intelligently and with particular accuracy. The high production accuracy is a winning factor in industry sectors such as the automotive supply industry. Application possibilities ...

Power: 100 W

Advantages 1. In the ordinary models of fixed-focus frame part of the full package protection design, can effectively avoid in the marking process, misoperation of the hand into the inside, the laser irradiation of the skin to produce ...

The coil winding process is now more efficient and precise with our reactor winding system, seamlessly combining advanced technology. This innovative system allows you to easily adjust the following critical parameters: • Winding Speed ...

Electroplating is used for the finishing of technical or decorative surfaces. At Micro + Hega Surfaces you will find systems for all types of electroplating, such as gold plating silver plating chrome plating zinc plating copper ...

Laser is used to mark characters and barcode types on PCB or objects Feature . PC Control . Smema Communication . Marking Speed : 250 text/sec . Light Output : 20W . Wave Length : 1064nm . Precise positioning with servo ...

Automatic winding machines are used both in electric motor repairs and in serial manufacturing, for example in the production of large motors. SCHLEICH offers an extensive range of PC-controlled automatic coil winding machines for different ...

Advantages Formation of an intermetallic phase between the tin and the copper-based strip without any additional reflow process Finish with preferred tin whisker mitigation practices according to iNEMI-Recommendations, 12-1-06 ...

It is a manual bonding machine designed for prototyping and small series that allows high precision and high technology in bonding with a very limited investment. The machine puts no technological limits to the kind of boards you need ...

Laser Trimmer 1.Creative use of customized fiber laser instead of traditional solid laser to provide the highest cost-performance 2.Self-designed measurement / control system with independent intellectual property rights 3.Proprietary ...

Ionization Chamber are manufactured with the cutomized design of anti-static bars, especially designed for the static elimination of flowing particle materials. In Industry raw material can mostly not be used only itself, it is generally ...

CXMET is a direct factory, located in Baoji valley, and we had installed a series of machines to produce and test the support. Hafnium sputtering target is one of the rare metals in our factory, they all could be customized from CXMET. FAQ 1. ...

This machine is the deeply processing equipment of EPE foam sheet/film products, mainly used for the adhesive bonding and thickening of EPE foam sheet/film, increasing the intensity and thickness, widely used for the packing of electronic ...

0 Multiple sizes available Mainstream 812" ceramictable(Optional) . 03 High configuration Standard image recognition.Standard NCS (non-contact setup) function. 02 High standards Comply with international standards,high precision ...

Exposure Machine ◆ PHILIPS exposing system ◆ Efficiency vacuum system ◆ Customizable as special products YD-FP912  Exposure Machine ◇  Automatic mechanical device to open and close the cover.  ◇  PHILIPS exposing system, durable ...