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... FR4 . Polyimide . Rogers . CEM3 Each material has its own fields of use. For each material you can choose: . Number of layers . PCB tthickness . Surface finish
Flexible printed circuit boards (FPC) has become a common component of electronic products due to its lightness and flexibility performance. It is widely used in smart terminal, wearable ...
Kinwong
... common design. Rigid-flex with 2-16L rigid board and 1-6L flex board Air gap structure on flexible area Rigid-flex PCB with 2-step HDI Rigid-flex with asymmetric structure (1 flexible ...
Kinwong
Tecnometal produces printed circuits from 2 to 36 layers and according to IPC 600 specifications (latest version) in class 1 - 2 - 3. Able to meet the expectations of the most demanding ...
Substrate Material FR-4 Process Characteristics High Density Board Thickness/Copper Thickness 1.2-2.0mm/35um Surface Treatment OSP/ENIG,etc.
PCBWay
Substrate Material FR-4 Process Characteristics High Density P1.25-P2.5 Board Thickness/Copper Thickness 1.2-2.0mm/35um Surface Treatment OSP/ENIG,etc.
PCBWay
... the number of layers of multilayer PCB board. At present, there are more than 100 layers of multilayer PCB board, commonly 4L and 6L ...
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