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Applicable for air reflow – crack free flux residue solder paste S3X58-CF100-2 Sn 3.0Ag 0.5Cu Highly reliable solder paste with "Crack-Free residue" Technology Suppresses ion migration By adopting ...
Koki Company Limited
Solder paste developed in collaboration with TOYOTA Corporation GSP Sn 3.0Ag 0.5Cu Crack-Free residue technology for reliable auto-applications No residue washing or coating required GSP's crack-free flux residue ...
Koki Company Limited
... a newly developed lubrication technique S3X70-G835 adopts a type of non-volatile solvent as its primary constituent, and can keep itself from drying when the paste is left idle. A better print-to-pause ...
Koki Company Limited
... solder paste for super find pitch and micro components S3X70-M500D Sn 3.0Ag 0.5Cu Solder the right "Spot".Not "Area" soldering. Uniformly spherical solder powder The reason why graping often occurs while using ...
Koki Company Limited
... applicable solder paste E150DN series Sn 3.0Ag 0.5Cu JET" brings about various advantages Consistently Deposited Solder Non-contact application of solder paste allows repeated deposition to one ...
Koki Company Limited
Solder Paste for IGBT / MOSFET Module Manufacturing that Requires No Cleaning Ultimately Low Voiding E12 series ensures extremely low voiding regardless of the type of solder alloy. Also, it does not cause solder ...
Koki Company Limited
Copper-based pastes for furnace brazing are quite versatile: They are characterized by their easy dosability They can be used in different protective atmospheres They are widely ...
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