Epoxy adhesives

... 2000 Adhesive Core Range. Whether you need to assemble high-performance products, or make repairs on the fly in tough conditions, these adhesives provide you with a safe, straightforward and streamlined ...

Two-part engineering adhesives provide high strength, structural joints. They are suitable for bonding metals, ceramics, wood and some plastics and they are supplied in a pratical dual cartridge dispenser. Curing occours ...

Working temperature: 10 °C - 30 °C

... Power Epoxy Universal Mix in a tube gives you a super strong bonding power you need for most materials. Not only does it dry transparently but it won’t expand or shrink when curing. Resistant to water, oil and common ...

Permabond two part epoxy adhesives are suitable for bonding a wide variety of materials. They are available with a range of different cure speeds to suit, Permabond epoxies have been ...

Working temperature: -30 °C - 120 °C
Packaging: 195 ml

... high-strength epoxy adhesive with very good adhesion properties on a wide variety of substrates. It is specifically designed for metal and composite panel bonding. The glass beads guarantee a uniformed ...

... compared to traditional epoxies; unique indicator system takes the guesswork out of “ready to use”. Features • General purpose epoxy with non-drip gel formula for mess free application • Blue dye ...

High-strength 2-component epoxy resin system for bodywork repairs Chemical basis: Epoxy resin Colour: Black Density: 1.1 g/cm³ Smell/fragrance: Characteristic Min. tensile strength: ...

Working temperature: -55 °C - 125 °C

... conductive epoxy combines the strong adhesive characteristics of epoxy with the superior conductivity of pure silver. Click into part number to purchase online now. Parker Chomerics ...

Working temperature: -55 °C - 148.89 °C

... Scotch-Weld™ Epoxy Adhesive DP125 is a low odor, two-part epoxy structural adhesive that creates strong and flexible bonds on metal, ceramics and many plastics where ...

It is mainly an adhesive for screws, bolts, and joints. It will not harden as long as it is in contact with air, but once it enters a very small gap in metals and other materials, it hardens quickly.

Working temperature: 10 °C - 30 °C

WEICON Minute Adhesive yellow is a viscous casting compound which cures quickly and is impact-resistant. The casting resin is self-levelling, impact-resistant, has a high adhesive strength and is free ...

Working temperature: 15 °C - 25 °C

... certification pending ¬ Low Toxicity Hardener Formulations Spabond™ 435 is a highly versatile toughened, high performance adhesive system that is suitable for bonding a wide range of materials. Spabond™ 435 has been ...

This high-strength 2-part adhesive achieves constructional friction-locked assemblies with an excellent heat- and weather resistance. SPECIAL CHARACTERISTICS • Tough-hard adhesive joint • ...

Saratoga STUCCO RAPIDO RIPARATUTTO: bi-component epoxy repair putty that hardens rapidly, even under water. Can be applied in any thickness on fibreglass, metal, cement, wood, marble and ceramic surfaces. Solvent-free, ...

... between components (electrically conductive adhesive). One of the applications is EMI shielding. The conductive glue cures at room temperature and has excellent filling properties. The viscosity of conductive ...

... from falling, shifting, or floating during reflow Using a conventional adhesive with solder paste can result in the lifting of components during reflow because the adhesive cures before the solder ...

Working temperature: -40 °C - 250 °C

H-621 is a single-component adhesive, based on modified epoxy resin. It is well suitable for strain gages with thin backing and those that work in elevated humidity environment. Operating temperture range ...

The EP kit - quick-bonding epoxide filler used to make-up surface defects, seal and cement. After hardening, the filling is suitable for mechanical working.

Adhesive for metal frames angles Two-part epoxy adhesive solventless, suitable for bonding aluminium, steel, wood, ceramic, marble, concrete. High resistance to water, oils, alkali, diluted ...

Working temperature: 60, 80 °C
Polymerization time: 60, 20 min

... levels, selected for the glass transition temperature and modulus for the intended application. Low temperature curing adhesive, typical applications include memory card, CCD or CMOS assembly. This product is suitable ...

... in Lead-Free Profile - Non-Hygroscopic - No Voiding One-Step Underfill 688 is a low surface tension, one component epoxy resin designed as a one-step no-flow underfill for flip chip, CSP, BGA and micro-BGA assemblies. ...