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Polymerization time: 3 s
This 1-step UV cure epoxy adhesive is specifically designed for high resolution automotive Camera Module bonding applications, such as lens barrel-to-housing and lens housing-to-circuit board. If cycle ...
... Features - Convenient handling - Excellent structural adhesive - Combines low viscosity and optical clarity - Provides superior electrical insulation values Master Bond EP31 is a two part epoxy ...
Master Bond
... stability • Very little shrinkage upon cure • Cationic curing system Master Bond UV15LV is a high strength, low viscosity, epoxy based UV curable system for bonding, sealing and coating. It is especially noteworthy ...
Master Bond
... curing system, no oxygen inhibition • Passes NASA low outgassing tests Master Bond UV16 is a low viscosity, high strength epoxy based UV curable system for bonding, sealing and coating. It is 100% reactive and does ...
Master Bond
Working temperature: 140 °C
DELO-DUOPOX – 2-part epoxy glue range with outstanding strength. DELO offers a range of 2-component adhesives made from epoxy resin: This is a variety of glues ...
DELO Industrial Adhesives
DELO is known for supplying various light curing and UV-curing epoxy resins. The product ranges includes adhesives for complex automotives and optoelectronic applications, with the chip encapsulants being ...
DELO Industrial Adhesives
... substrates • Optimum flow behavior for sealing and casting • Transparent dual cure adhesives available for large bonding areas Please note: We supply hightech adhesives exclusively to manufacturing ...
DELO Industrial Adhesives
... 2000 Adhesive Core Range. Whether you need to assemble high-performance products, or make repairs on the fly in tough conditions, these adhesives provide you with a safe, straightforward and streamlined ...
Huntsman Advanced Materials
Working temperature: -60 °C - 340 °C
Kohesi Bond KB 1427 HT is a marvelous single component epoxy system for bonding, coating, sealing and casting applications. Although it requires a minimum temperature of 150°C for curing, it can achieve faster cures at ...
Kohesi Bond
Working temperature: -50 °C - 200 °C
Kohesi Bond KB 1427 HT-3 is an exclusive one component epoxy system that can cure completely in 2 – 3 minutes at 150°C. Although it requires a minimum temperature of 120°C for curing, it cures equally fast (3 – 5 minutes) ...
Kohesi Bond
Working temperature: -50 °C - 200 °C
... insulation, KB 1613 HT also offers phe-nomenal chemical resistance to a variety of acids, bases, fuels, oils and water. This epoxy is available in a non-drip, non-sag viscosity which can even be applied on vertical surfaces ...
Kohesi Bond
Two-part engineering adhesives provide high strength, structural joints. They are suitable for bonding metals, ceramics, wood and some plastics and they are supplied in a pratical dual cartridge dispenser. Curing occours ...
... between components (electrically conductive adhesive). One of the applications is EMI shielding. The conductive glue cures at room temperature and has excellent filling properties. The viscosity of conductive ...
Permabond two part epoxy adhesives are suitable for bonding a wide variety of materials. They are available with a range of different cure speeds to suit, Permabond epoxies have been ...
Permabond
Working temperature: -30 °C - 120 °C
Packaging: 195 ml
... high-strength epoxy adhesive with very good adhesion properties on a wide variety of substrates. It is specifically designed for metal and composite panel bonding. The glass beads guarantee a uniformed ...
... compared to traditional epoxies; unique indicator system takes the guesswork out of “ready to use”. Features • General purpose epoxy with non-drip gel formula for mess free application • Blue dye ...
PERMATEX
High-strength 2-component epoxy resin system for bodywork repairs Chemical basis: Epoxy resin Colour: Black Density: 1.1 g/cm³ Smell/fragrance: Characteristic Min. tensile strength: ...
Working temperature: -55 °C - 125 °C
... conductive epoxy combines the strong adhesive characteristics of epoxy with the superior conductivity of pure silver. Click into part number to purchase online now. Parker Chomerics ...
Parker Chomerics Division
Working temperature: -55 °C - 148.89 °C
... Scotch-Weld™ Epoxy Adhesive DP125 is a low odor, two-part epoxy structural adhesive that creates strong and flexible bonds on metal, ceramics and many plastics where ...
Working temperature: 10 °C - 30 °C
... Power Epoxy Universal Mix in a tube gives you a super strong bonding power you need for most materials. Not only does it dry transparently but it won’t expand or shrink when curing. Resistant to water, oil and common ...
PATTEX
Working temperature: 10 °C - 30 °C
WEICON Minute Adhesive yellow is a viscous casting compound which cures quickly and is impact-resistant. The casting resin is self-levelling, impact-resistant, has a high adhesive strength and is free ...
WEICON
Working temperature: 15 °C - 25 °C
... certification pending ¬ Low Toxicity Hardener Formulations Spabond™ 435 is a highly versatile toughened, high performance adhesive system that is suitable for bonding a wide range of materials. Spabond™ 435 has been ...
Gurit
This high-strength 2-part adhesive achieves constructional friction-locked assemblies with an excellent heat- and weather resistance. SPECIAL CHARACTERISTICS • Tough-hard adhesive joint • ...
It is mainly an adhesive for screws, bolts, and joints. It will not harden as long as it is in contact with air, but once it enters a very small gap in metals and other materials, it hardens quickly.
THREE BOND
... from falling, shifting, or floating during reflow Using a conventional adhesive with solder paste can result in the lifting of components during reflow because the adhesive cures before the solder ...
Koki Company Limited
Working temperature: -40 °C - 250 °C
H-621 is a single-component adhesive, based on modified epoxy resin. It is well suitable for strain gages with thin backing and those that work in elevated humidity environment. Operating temperture range ...
High precision measurement LLC
The EP kit - quick-bonding epoxide filler used to make-up surface defects, seal and cement. After hardening, the filling is suitable for mechanical working.
Adhesive for metal frames angles Two-part epoxy adhesive solventless, suitable for bonding aluminium, steel, wood, ceramic, marble, concrete. High resistance to water, oils, alkali, diluted ...
Working temperature: 60, 80 °C
Polymerization time: 60, 20 min
... levels, selected for the glass transition temperature and modulus for the intended application. Low temperature curing adhesive, typical applications include memory card, CCD or CMOS assembly. This product is suitable ...
Shenzhen DeepMaterial Technologies Co., Ltd
... in Lead-Free Profile - Non-Hygroscopic - No Voiding One-Step Underfill 688 is a low surface tension, one component epoxy resin designed as a one-step no-flow underfill for flip chip, CSP, BGA and micro-BGA assemblies. ...
Working temperature: -50 °C - 80 °C
Colour, transparent High strength and fast hardening construction adhesive for a rigid bond Temperature resistant from -50°C to +80°C Offers a remarkably fast application time of approx. 5 min. Also used in the casting ...
STALOC
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