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Panasonic's MD-P200 is a high-productivity die bonder. The synchronous head system offers unparalleled productivity, providing results that surpass conventional die bonders. ...
Panasonic Factory Automation Company
... Capability •Single pass production for complex products •Die attach, flip chip, multi-chip in one machine •Epoxy writing & stamping, flux dipping •Die pick from wafer, waffle pack, ...
BE Semiconductor Industries N.V.
... specialized configuration of the 6500 Die Bonder for wafer scale packaging eutectic die bonding is also available. Wafer Scale Packaging (WSP) Wafer Scale Packaging (WSP) eutectic ...
PALOMAR TECHNOLOGIES
The iStack™ S+ is designed for high-end epoxy and film die attach applications with process flexibility to support both the memory and image applications. Its enhanced process features include the face-down ...
With motorized Z - Axis With our Die Bonder HB75 die bonding tasks can be handled with ease and precise. Touch Screen Easy Handling and Control with the 6,5" TFT Our long tested ...
... Assembly Applications: PLATFORM FOR DIE ASSEMBLY AND SMALL SMD PLACEMENT Lab and Prototype (Lab, Jewelry, Watches, smd, BGA,..) Small parts handling capability Solder paste SMD Reflow Eutectic die ...
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