Eutectic die bonders

... optionally 14), 5 eject tools Stamping tools and calibration tools possible Die attach, flip chip and multi-chip in one machine Die pick from: wafer, waffle pack, Gel-Pak®, feeder Die ...

The Die Bonder Esec 2100 hS is the 3rd generation of the most flexible 300 mm high speed platform, capable of running an extensive range of epoxy die attach applications such as QFN, ...

... specialized configuration of the 6500 Die Bonder for wafer scale packaging eutectic die bonding is also available. Wafer Scale Packaging (WSP) Wafer Scale Packaging ...

... range of markets and applications. Processes Silver Sintering Die Bonding, Eutectic Die Bonding, Epoxy Die Bonding, UV Die Bonding, Solder Paste ...

Budget sensitive Manual Die Bonder The T-4909-AE is Tresky's 40-year anniversary model. On basis of the T-4909 we developed a new software running on an integrated Raspberry PC. Like all Tresky Die ...

The T-3002-M is a manual, precise, high quality die bonder & component placer with superior ergonomic design and a fix die ejector needle. As with all of Tresky’s products, the T-3002-M ...

... to operate. The T-3002-PRO is a Chip Bonder with programmable and motorised Z-achses. It is also equiped with Tresky's proven die ejector system for pick-up from wafer. Advanced multi functional ...

... PC software even easier to operate. Advanced multi functional Die Bonder with superior ergonomic design and programmable, high accuracy ZDrive and bonding force control. Die Attach, ...

... case of a 200 mm bond chamber). This tool supports all common wafer bonding processes such as anodic, glass frit, solder, eutectic, transient liquid phase, and direct. The easy access bond chamber and tooling design allows ...