{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
Panasonic's MD-P200 is a high-productivity die bonder. The synchronous head system offers unparalleled productivity, providing results that surpass conventional die bonders. ...
Panasonic Factory Automation Company
... one machine Multi-Chip Capability Single pass production for complex products Die attach, flip chip, multi-chip in one machine Epoxy writing & ...
BE Semiconductor Industries N.V.
High-Accuracy & High-Speed machine confirmed with global IDM demos. Configuration8 Head (2Gantry x 4Head) Productivity15,000 UPH Accuracy±4um @ 3σ ForceMax. 30N
... method for the next generation. TDK is proud to introduce its new high-reliable, space-saving, low price equipment: AFM-15 Flip Chip Bonder (Ultrasonic Bonding Process). Low-energy bonding ...
The ACCμRA M is a manual Flip-Chip Bonder that permits to reach ± 3 μm post-bond accuracy. The only motorized axis is the arm, which controls precisely the bonding force. Combining ...
... or ACF, NCP dispense. Highlights • Flip chip placement, reflow & curing in one step • Fluxfree reflow with laser • No additional reflow or curing • Suitable for Flip Chip ...
Budget sensitive Manual Die Bonder The T-4909-AE is Tresky's 40-year anniversary model. On basis of the T-4909 we developed a new software running on an integrated Raspberry PC. Like all Tresky Die ...
Dr. Tresky AG
With motorized Z - Axis With our Die Bonder HB75 die bonding tasks can be handled with ease and precise. Touch Screen Easy Handling and Control with the 6,5" TFT Our long tested ...
... for industrial usage in production environments. Typical Tasks • Pick and place • Die sorting • Dispensing of adhesives • UV curing • Chip to chip bonding • Chip ...
Please specify:
Help us improve:
remaining