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... applications. * Large (4096×4096 pixel) array with either 10 µm or 15 μm pixel pitch. * Compatible with Teledyne Imaging Sensors (TIS) HgCdTe infrared (IR) and silicon PIN HyViSI™ visible ...
Rockwell Scientific
... ground-based and space telescope applications. Large (2048×2048 pixel) array with 18 μm pixel pitch. Compatible with Teledyne Imaging Sensors (TIS) HgCdTe infrared (IR) and silicon PIN HyViSI™ visible ...
Rockwell Scientific
JIR-10XX Thermal Imaging Core Module Application To be incorporated into various types of uncooled thermal imagers Functional characteristics 1.Small size, light weight and high reliability 2.Auto/Manual NUC 3.Auto/Manual ...
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