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The Esec 2100 hS ix is the latest member of the 2100 i Die Bonder family. It is optimized for highest speed and scratch-free transport thanks to the easy-to-use motorized and programmable rail strip handler. The ...
BE Semiconductor Industries N.V.
... Performance 4th Generation Vision System High Speed Production Mode with excellent accuracy Intelligence in Automation Automated Bond Head Tilt Adjustment Auto Adjusting Pick Up Tool and Capillary offsets
BE Semiconductor Industries N.V.
... new Esec Die Bonder 2009 SSIE is engineered to meet all upcoming challenges in power die attach. Its unprecedented productivity and process control are unmatched in the industry. Thanks ...
BE Semiconductor Industries N.V.
The Esec 2009 fSE is the fastest soft solder die bonder in the industry with a broad application range. First to mention the point-to-line pick & place with stationary indexer, which enables increased ...
BE Semiconductor Industries N.V.
As mass reflow Flip Chip becomes dominant in IC packaging, Besi again sets the benchmark for speed and productivity with its new Datacon 8800 FC QUANTUM advanced. The state of the art motion control, unique CRYSTAL - glass based fluxer ...
BE Semiconductor Industries N.V.
... attaching thinner die and substrates, the iStack™ W+ offers a solution for wafer level die attach. Features & Options High Accuracy kit (5 μm) Mapping Functions (Substrate / Wafer) Wafer / Substrate ...
The CL2000 multi-purpose die bonder is a system designed for customers in the semiconductor and photonics packaging market. It can be confi gured to a wide range of tasks in a wide range of production environments. The ...
Automated Prototype2Production Bonder The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete ...
Finetech
Semi-automated Sub-Micron Bonder The FINEPLACER® sigma combines sub-micron placement accuracy with a 450 x 150 mm working area and bonding forces up to 1000 N. The system is ideal for all types of precision die ...
Finetech
Flexible Sub-micron Die Bonder The flexible FINEPLACER® lambda is a sub-micron die-bonder for precision die attach and advanced chip packaging. It ...
Finetech
Fully-Automatic Mounting Machine AC100 AC100 is a piece of high-stability and high-precision mounting equipment which is developed based on the precision assembly process requirements of modules and ...
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