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Rotational speed: 3 rpm - 30 rpm
... wafer polishing machine series for use in the semiconductor industry. The new FLP Wafer 1700 nano is a wafer double-sided polishing machine. For the first time, chemically resistant granite ...
Feinschleif-, Läpp- und
Power: 5 kW - 38.5 kW
Rotational speed: 800, 1,100, 600 rpm
The HIGH PRECISION twin-disc machine series is a unique series of machine tools with a high damping granite chassis. It acts as a know-how driver for maximising precision in all areas ...
Feinschleif-, Läpp- und
Power: 6.1 kW
Rotational speed: 250 rpm - 10,000 rpm
Functions : milling, drilling, milling of inside and outside in automatic mode, polishing, routing, calibrating, horizontal sawing, flat polishing A multipurpose machine The positioning of the pieces ...
Power: 23 kW
The innovative compact Brushstone™ System, can be placed after the traditional flaming or after the new Water Texturing system Waterstone™‚ in order to brush or bush-hammer automatically any kind of stone material after have been already ...
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