High-accuracy die bonders

10 companies | 28 products
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flip-chip die bonder
flip-chip die bonder
MD-P200

... MD-P200 is a high-productivity die bonder. The synchronous head system offers unparalleled productivity, providing results that surpass conventional die bonders. ...

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Panasonic Factory Automation Company
die-attach die bonder
die-attach die bonder
Datacon 2200 evo

... . High Performance at High Accuracy Highest accuracy ± 10 µm @ 3 Sigma (7 µm on request) High productivity, low cost-of-ownership Up to 4 working ...

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BE Semiconductor Industries N.V.
flip-chip die bonder
flip-chip die bonder
SFM5

High-Accuracy & High-Speed machine confirmed with global IDM demos. Configuration8 Head (2Gantry x 4Head) Productivity15,000 UPH Accuracy±4um @ 3σ ForceMax. 30N

epoxy die bonder
epoxy die bonder
6500

The Palomar 6500 high precision component placement Die Bonder is designed for high-speed, fully automated precision component assembly ...

epoxy die bonder
epoxy die bonder
ISTACK S+

The iStack™ S+ is designed for high-end epoxy and film die attach applications with process flexibility to support both the memory and image applications. Its enhanced process features include the face-down ...

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Kulicke & Soffa
die-attach die bonder
die-attach die bonder
ACCμRA M

The ACCμRA M is a manual Flip-Chip Bonder that permits to reach ± 3 μm post-bond accuracy. The only motorized axis is the arm, which controls precisely the bonding force. Combining and synchronizing ...

micro assembly die bonder
micro assembly die bonder
LaPlace – VC

... the vacuum pick and place unit of the bonder. Due to the high flexibility of the laser thermode, the system requires only a thin layer of solder on the substrate. Highlights • In-Line capability • ...

high-accuracy die bonder
high-accuracy die bonder
130N

... allows repeatability and reliability obtaining high registration precision between the inner layers (Tooling template accuracy <10 microns). The multilayer stack, previously mounted on ...

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InduBond®
sub-micron die bonder
sub-micron die bonder
FINEPLACER® femto 2

Automated Prototype2Production Bonder The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure ...

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Finetech
fully-automatic die bonder
fully-automatic die bonder
AC100

Fully-Automatic Mounting Machine AC100 AC100 is a piece of high-stability and high-precision mounting equipment which is developed based on the precision assembly process requirements ...

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