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High-accuracy die bonders
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
Automated Prototype2Production Bonder The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure ...
Finetech
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Automatic Multi-Purpose Bonder The FINEPLACER® femtoblu is an automated micro assembly cell with a placement accuracy of 2.0 µm @ 3 Sigma and ultra-low bonding force capability for photonic applications. Designed ...
Finetech
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Multi-Purpose Manual Die Bonder The FINEPLACER® pico 2 is a versatile manual die bonder with placement accuracy down to 3 µm. Quick to set up and ...
Finetech
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... MD-P200 is a high-productivity die bonder. The synchronous head system offers unparalleled productivity, providing results that surpass conventional die bonders. ...
Panasonic Factory Automation Company
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... Datacon 2200 evo is prepared for present and future processes and products. •High Performance at High Accuracy •Highest accuracy ± 10 µm @ 3 Sigma ...
BE Semiconductor Industries N.V.
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High-Accuracy & High-Speed machine confirmed with global IDM demos. Configuration8 Head (2Gantry x 4Head) Productivity15,000 UPH Accuracy±4um @ 3σ ForceMax. 30N
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The Palomar 6500 high precision component placement Die Bonder is designed for high-speed, fully automated precision component assembly ...
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The iStack™ S+ is designed for high-end epoxy and film die attach applications with process flexibility to support both the memory and image applications. Its enhanced process features include the face-down ...
Kulicke & Soffa
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The ACCμRA M is a manual Flip-Chip Bonder that permits to reach ± 3 μm post-bond accuracy. The only motorized axis is the arm, which controls precisely the bonding force. Combining and synchronizing ...
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... the vacuum pick and place unit of the bonder. Due to the high flexibility of the laser thermode, the system requires only a thin layer of solder on the substrate. Highlights • In-Line capability • ...
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... allows repeatability and reliability obtaining high registration precision between the inner layers (Tooling template accuracy <10 microns). The multilayer stack, previously mounted on ...
InduBond®
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Fully-Automatic Mounting Machine AC100 AC100 is a piece of high-stability and high-precision mounting equipment which is developed based on the precision assembly process requirements ...
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