High-accuracy die bonders

... MD-P200 is a high-productivity die bonder. The synchronous head system offers unparalleled productivity, providing results that surpass conventional die bonders. ...

... Datacon 2200 evo is prepared for present and future processes and products. •High Performance at High Accuracy •Highest accuracy ± 10 µm @ 3 Sigma ...

High-Accuracy & High-Speed machine confirmed with global IDM demos. Configuration8 Head (2Gantry x 4Head) Productivity15,000 UPH Accuracy±4um @ 3σ ForceMax. 30N

The Palomar 6500 high precision component placement Die Bonder is designed for high-speed, fully automated precision component assembly ...

The iStack™ S+ is designed for high-end epoxy and film die attach applications with process flexibility to support both the memory and image applications. Its enhanced process features include the face-down ...

The ACCμRA M is a manual Flip-Chip Bonder that permits to reach ± 3 μm post-bond accuracy. The only motorized axis is the arm, which controls precisely the bonding force. Combining and synchronizing ...

... the vacuum pick and place unit of the bonder. Due to the high flexibility of the laser thermode, the system requires only a thin layer of solder on the substrate. Highlights • In-Line capability • ...

... allows repeatability and reliability obtaining high registration precision between the inner layers (Tooling template accuracy <10 microns). The multilayer stack, previously mounted on ...

Automated Prototype2Production Bonder The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure ...

Fully-Automatic Mounting Machine AC100 AC100 is a piece of high-stability and high-precision mounting equipment which is developed based on the precision assembly process requirements ...