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- Intel® Xeon computer-on-module
Intel® Xeon computer-on-modules
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COM Express Type 7 with Intel® 3rd Gen XEON D Processor Features - Intel® Idaville Platform Ice Lake-D (XEON-D) LCC series, max TDP 69W - 2x SODIMM DDR4 Sockets, up to 64GB (ECC Support) - Intel i210IT Gigabit Ethernet x1 - 10GbE ...
The COMe-bID7 (E2) with scalability from 4 to 10 cores on a small form factor and SKUs for industrial temperature range of -40°C up to +85° as well as 24x7 / 10 years reliability allows robust, space-constraint implementations in harsh ...
Kontron
COMe-bKL6 and COMe-bKL6R E2S deliver a new generation of high performance, feature-rich COM-modules based on the COM Express® basic standard form factor (125 x 95mm) and Intel® 7th Generation Core™ / Xeon® E3 v6 Family processors. These ...
Kontron
The COMe-bCL6(R E2S) offers increased performance density together with excellent graphic support on a standardized Type 6 Computer-on-Module based on the COM Express basic form factor. Through the use of consistent COM Express connectors ...
Kontron
Computer-on-module, or COM, is a development board with computer processor, chipset, memory, and peripherals designed into a component module. Advantech Computer-on-Module series include: COM-Express Basic, COM-Express Compact, COM-Express ...
ADLINK’s Express-ID7 COM Express Type 7 Basic Size module is based on the Intel® Xeon® D-1700 processor and features integrated high-speed Ethernet for up to 4x 10G combined with 16 PCIe Gen4 lanes for instantaneous responsiveness and ...
ADLINK TECHNOLOGY
Memory size: 0 GB - 64 GB
SOM-COMe-BT6-CFL-H is a COM Express® Basic Type 6 Computer on Module (CoM) with Intel® 8th generation Core™/ Xeon® (formerly Coffee Lake H) and 9th generation Core™ / Xeon® / Celeron® (formerly Coffee Lake Refresh) CPUs reaching a maximum ...
SECO S.p.A.
COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (formerly Tiger Lake-H) Processors for FuSa applications Graphics Integrated Iris Xe Graphics Core Gen12 architecture, ...
SECO S.p.A.
Memory size: 64 GB
COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (Codename: Tiger Lake-H) Processors for FuSa applications. (LAGOON - D57)
SECO S.p.A.
Dual DDR4 SODIMM 2933MHz up to 96GB (ECC support) Support extended operating temperature: -40 to 85°C 10GBASE-KR: Support up to 4 x 10GbE Mac ports Multiple Expansion: 1 PCIe x16 (Gen4), 2 PCIe x8 (Gen3), 1 SMBus, 1 I2C, 1 LPC, 2 UART ...
Memory size: 32 GB
This COM Express® module COMe-bBD6 extends Kontron’s product family of server-class COM platforms. The module features data-centre-grade CPU performance with up to 16 cores. This robust performance is combined with support for two 10GbE-KR ...
Kontron America
COM-HPC Server Size E module based on Intel® Xeon® D processor series (code name "Ice Lake") Industrial Use Condition with extended Temperature options 48 PCIe Express lanes AI Capabilities with Intel® DL boost Real Time Capable ...
Congatec
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