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- Internal cylindrical grinding center
Internal cylindrical grinding centers
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X travel: 500 mm
Y travel: 600 mm
Currently the only machine of its kind, the BoulePro 200 allows for a much faster and cost-effective boule-to-puck conversion to meet the high demand for Silicon Carbide (SiC), a crucial semiconductor material. With its Single-Step Dual-plane ...

... during set-up and optimisation of grinding projects. Due to the use of auxiliary spindles small grinding wheels can be applied. Both involute internal gears and special profiles can ...

Spindle speed: 12,000 rpm - 22,000 rpm
Power: 20 kW - 26 kW
X travel: 1,800 mm
Compact vertical grinding center for 5-side machining in one step The NEO 5 is characterized by a particularly compact design with high precision. In addition to the compact design, the KEHREN NEO ...
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