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- Low outgassing adhesive
Low outgassing adhesives
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... levels. The low outgassing properties enable this UV to be used in a wide array of optical, electro-optical and vacuum applications that until now have not been possible for UV curable systems. It should ...
Master Bond

... EP30LTE-LO is a specialty epoxy system featuring an exceptionally low coefficient of thermal expansion (CTE) that meets NASA low outgassing specifications. It can be used in bonding, ...
Master Bond

... potting and coating system. Because it is thermally conductive, it transfers heat efficiently. This epoxy passes NASA low outgassing test requirements which allow it to be used in vacuum, aerospace and ...
Master Bond

... filler for bonding and smaller gap filling Key Features * High thermal conductivity * Very good electrical insulator * Low exotherm * High flexibility and temperature resistance Master Bond MasterSil 151TC is ...
Master Bond

... conductive & electrically insulative - Flexibilized and toughened - Unlimited working life at room temperature - Meets NASA low outgassing specifications Master Bond EP36AO is a unique one component, ...
Master Bond

Key Features - Low viscosity - Minimal shrinkage upon curing - Superb optical clarity - Cures at 80°C in shadowed out areas Master Bond UV22DC80-1 is a nanosilica filled, dual cure epoxy based system. It is formulated ...
Master Bond

... from -80°F to +600°F. Since it passes NASA low outgassing, it can be used in vacuum type situations and other applications where that requirement is needed. EP17HTDA-1 is used primarily as a die attach ...
Master Bond

... high tech aerospace, electronics, optical and specialty OEM applications. Key Features • Thixotropic low viscosity • Meets NASA low outgassing specifications • Minimal shrinkage ...
Master Bond

Superior Toughened Epoxy Chemically resistant, toughened epoxy, Master Bond Supreme 62-1, features excellent flow properties and a long working life. With a wide service temperature range of -60°F to 450°F, it resists acids, bases and ...
Master Bond

Working temperature: -80 °F - 400 °F
Master Bond EP3HTS-TC is a one part, NASA low outgassing rated epoxy, with an outstanding thermal conductivity of 16-17 W/(m·K). It cures rapidly at temperatures of around 250-300°F [~ 125-150°C], and ...
Master Bond

... stability should also be mentioned. Other important properties of this item include low shrinkage during polymerization, along with a good chemical resistance, low outgassing and high ...

Working temperature: 180 °C - 200 °C
Polymerization time: 20 s - 40 s
... TRANSPARENT GRANULE GLUE FOR CARTON CLOSURE Glue in transparent granules in ethylene vinyl acetate copolymer (EVA). For gluing coated papers and board, and for applications where a long open time is ...

Working temperature: -70 °C - 200 °C
... water. TUF 1613 HT-CM although most commonly used for glop topping, its superior performance and the ability to pass NASA low outgassing standards, makes it suitable for use in various electronics, aerospace ...
Kohesi Bond

Working temperature: -70 °C - 200 °C
... Remarkable die shear strength Ultimate dispensing profile Thermally conductive Low ionic content (chlorine < 15 ppm) Capable of passing NASA low outgassing Unlimited working ...
Kohesi Bond

Working temperature: -269 °C - 200 °C
... temperatures. TUF 1820 AOHT offers a sweeping serviceable temperature range of 4K and it is capable of passing NASA standards for low outgassing (ASTM E-595). This product can withstand severe thermal ...
Kohesi Bond

Working temperature: -269 °C - 200 °C
... resistance to a variety of acids, bases, fuels and water. Owing to its dazzling performance, capability of passing NASA low outgassing test and ease of use, TUF 1820 HTS is widely used in demanding electronics, ...
Kohesi Bond

... formula: R = l/K [“R” is the thermal resistance; “l” is the adhesive layer thickness; “K” is the thermal conductivity of the adhesive] Applying peculiar values, standard thermally conductive adhesives ...
Kohesi Bond

Working temperature: -269 °C - 120 °C
... Part A: Part B) mix ratio by weight. Remarkably, it offers stellar thermal conductivity and is capable of passing NASA low outgassing test, unlike most flexible epoxies. This epoxy system readily cures ...
Kohesi Bond

Working temperature: -70 °C - 180 °C
... 1:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent peel strength and is capable of passing NASA low outgassing test. The optimal cure schedule is an overnight room temperature set-up ...
Kohesi Bond

... is optically clear and it is capable of passing NASA standards for low outgassing (ASTM E-595). This superior adhesive fosters outstanding physical strength properties. It offers very ...
Kohesi Bond

... thermally conductive and it is capable of passing NASA standards for low outgassing (ASTM E-595). This superior adhesive fosters outstanding physical strength properties. It offers very ...
Kohesi Bond

Working temperature: -50 °C - 120 °C
... thermal conductivity Very low coefficient of thermal expansion Phenomenal dimensional stability Excellent flow properties Outstanding electrical insulation properties Capable of passing NASA low ...
Kohesi Bond
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