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X travel: 300 mm
Y travel: 400 mm
Repeatability: 1 µm
... is used for laser modification and cutting of silicon-based wafers in the semiconductor industry for 8-inch and above chip sealing and testing plants. •High quality There is no damage on the surface, ...
Farley Laserlab
X travel: 200 mm
Y travel: 300 mm
Repeatability: 2 µm
... picosecond laser is used for precision half cutting or full cutting of silicon and compound semiconductor wafers. • High quality Cutting line width is narrow (taking ...
Farley Laserlab
X travel: 200 mm
Y travel: 300 mm
Repeatability: 2 µm
... picosecond laser is used for precision half cutting or full cutting of silicon and compound semiconductor wafers. • High quality Cutting line width is narrow (taking ...
Farley Laserlab
X travel: 494 mm
Y travel: 882 mm
Z travel: 1,668 mm
... equipment is mainly developed for semiconductor and 3C industries. Suitable for cutting silicon, ceramics, glass, SiC and other materials. It has the advantages of fast cutting ...
Farley Laserlab
multi-wire cutting machineGC-MJ706R/908R
Photovoltaic Cutting Equipment General description: Launched in 2022, this product is designed for silicon rod cutting, with the featuring advantages of high yield, small slope, ...
Qingdao Gaoce Technology Co., Ltd.
Cutting speed: 2,400 m/min
Overall length: 6,250 mm
Overall width: 3,400 mm
... first single machine dual station and adjustable wheelbase design, this equipment is playing a significant role in the slicing process of silicon wafer manufacturing. It is compatible with the cutting ...
Qingdao Gaoce Technology Co., Ltd.
Weight: 16,500 kg
... the slicing process of silicon wafer manufacturing. The product adopts a brand new platformized design and industry-leadingadjustable small wheelbase design, which can be compatible with the cutting needs ...
Qingdao Gaoce Technology Co., Ltd.
Tube diameter: 301 mm
Cutting speed: 2,100 m/min
Overall length: 5,400 mm
... USES diamond wire to cut semiconductor single crystal silicon sheet. It can process silicon rod diameter compatible with 8 、“12" and the maximum processing length 450mm ...
Qingdao Gaoce Technology Co., Ltd.
Cutting speed: 0 mm/min - 900 mm/min
Overall length: 5,000 mm
Overall width: 2,560 mm
... processing equipment for cutting semiconductor monocrystalline silicon rod. The diameter of silicon rod that can be processed is 8-24 inches, and the maximum processing ...
Qingdao Gaoce Technology Co., Ltd.
Tube diameter: 201 mm
Cutting speed: 0 mm/min - 3 mm/min
Overall length: 5,400 mm
The is a special processing equipment where the diamond wire is used to cut semiconductor monocrystalline silicon and produce silicon wafers; it can process the silicon ...
Qingdao Gaoce Technology Co., Ltd.
Tube diameter: 6 in - 8 in
Overall length: 4,880 mm
Overall width: 2,100 mm
This product is a special processing equipment that adopts the diamond wire for cutting semiconductor silicon carbide wafers, it can process crystal rod of various diameters, compatible ...
Qingdao Gaoce Technology Co., Ltd.
laser cutting machineMLC7200C4-A
Laser power: 500 W
Overall length: 3,300, 2,600 mm
Overall width: 3,250, 3,600 mm
... the production of high-efficiency photovoltaic modules replaces the conventional laser dicing machine The core principle of non-destructive laser cutting is laser thermal stress controlled fracture ...
Maximum cutting height: 305 mm
Tube diameter: 305 mm
Cutting speed: 20, 35 m/s
... specifically designed for slicing monocrystalline silicon blocks with up to 300mm diameter into high quality wafers for the semiconductor industry. The new developed DW292-300 is capable to be run ...
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