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PCI Express computer-on-modules
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AAEON has partnered with Kneron to deliver modules featuring their innovative AI Edge Computing processor, the KL520 Neural Processor Unit (NPU). The KL520 provides efficient AI computing performance of 0.56 TOPS per Watt, perfect for ...
AAEON
Overview COM Express Type 6 Compact Size with AMD Ryzen™ Embedded R2000 Series Processors Features - DDR4 3200MHz SODIMM x 2, up to 32GB - USB 2.0 x 8, USB3.2 10Gbps x2, USB3.2 5Gbps x1 - PCIe [x4] x 1, PCIe [x1] x 4, PEG [x4] ...
AAEON
Overview COM Express Compact Type 6 with 11th Generation Intel® Core™ Processor Family (formerly Tiger Lake UP3) Features -11th Generation Intel® Core™ Tiger Lake-UP3 SoC Processor -2 x SODIMM DDR4 3200MHz Memory, up to 64GB (in-band ...
AAEON
The Kontron SMARC-sXBTi Computer-on-Modules has been developed to comply with the SGET specification and is equipped with Intel® Atom™ processor E3800 series and up to 8 GB RAM, optional with ECC. They support the extended temperature ...
Kontron
NXP based SMARC Computer-on-Modules enables highly scalable ultra-low power applications The highly scalable Kontron SMARC-sAMX6i modules with single, dual or quad core NXP i MX6 processors cover an extremely wide performance range. ...
Kontron
SMARC Module based on Cortex A8 technology Texas Instruments AM3874 up to 800MHz Very low power consumption Constructed to withstand harsh industrial environments ARM Cortex A8 based slim embedded solution for harsh environment
Kontron
Memory size: 2 GB - 8 GB
Unleash the full potential of the NXP i.MX8M Mini, featuring ARM® Cortex®-A53 processor. This empowers Artificial Intelligence (AI) and Machine Learning (ML) capabilities, enhances multimedia performance, supports cutting-edge Edge Computing, ...
VEST
Memory size: 1 GB - 3 GB
Unleash the full potential of the NXP i.MX8M Nano, featuring Arm® Cortex®-A53 cores and Cortex®-M7 core. This provides cost-effective integration and affordable performance for smart, connected, power-efficient devices requiring graphics, vision, ...
VEST
Memory size: 2 GB - 8 GB
Unleash the full potential of the NXP i.MX8M Plus, featuring ARM® Cortex®-A53 processor and Neural Processing Unit (NPU). This empowers Artificial Intelligence (AI) and Machine Learning (ML) capabilities, enhances multimedia performance, ...
VEST
Memory size: 0 GB - 64 GB
COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Core™ and Celeron® (formerly Tiger Lake-UP3) Processors Graphics Integrated Iris Xe Graphics Core Gen12 architecture, with up to 96 Execution Units MPEG2, WMV9, ...
SECO S.p.A.
Memory size: 64 GB
COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Xeon® W-11000E Series, Core™ vPro® and Celeron® (Codename: Tiger Lake-H) Processors for FuSa applications. (LAGOON - D57)
SECO S.p.A.
Memory size: 0 GB - 64 GB
SOM-COMe-BT6-CFL-H is a COM Express® Basic Type 6 Computer on Module (CoM) with Intel® 8th generation Core™/ Xeon® (formerly Coffee Lake H) and 9th generation Core™ / Xeon® / Celeron® (formerly Coffee Lake Refresh) CPUs reaching a maximum ...
SECO S.p.A.
ADLINK’s Express-TL COM Express Type 6 Basic size module is based on the 11th Gen Intel® Core™, Xeon® W and Celeron® 6000 processor, and is the first COM Express module to support PCI Express x16 Gen4, effectively doubling the bandwidth ...
ADLINK TECHNOLOGY
-Soldered onboard 7th Generation Intel® Core™ i7-7600U/i5-7300U processor -Intel® I219LM PCIe GbE PHY -Dual Channels 24-bit LVDS and 2 x DDI ports -Support 3 independent displays -5V~20V Wide Range Voltage Input -Wide Range Operating ...
Memory size: 64 GB
Intel® Core™ Ultra Processor (Meteor Lake: U/H-series) Dual Channel DDR5 5600MHz SODIMM up to 64GB Multiple Displays: 1 VGA + 1 LVDS/eDP + 3 DDI Supports 4K / 2K resolution Multiple Expansion: 2 PCIe x4, 5 PCIe x1, 1 PCIe x8, 1 I2C, ...
DFI
Memory size: 16, 8 GB
Intel® Atom® Processor Amston Lake Series Dual Channel LPDDR5 4800MHz up to 16GB 1 LVDS/eDP, 1 DDI (HDMI/DP++);Supports dual displays: DDI + LVDS/eDP Multiple expansions: 4 PCIe x1, 1 SMBus, 1 I2C, 1 eMMC Rich I/O: 2 USB 3.1, 8 USB ...
DFI
Memory size: 64 GB
Intel® Core® Processor Raptor Lake Series DDR5 4800MHz SODIMM up to 64GB 1 LVDS/eDP, 1 VGA, 3 DDI (HDMI/DP++) Multiple expansions: 2 PCIe x4 (Gen4 PCH), 5 PCIe x1 Rich I/O: 1 Intel GbE, 4 USB 3.2, 8 USB 2.0 15-Year CPU Life Cycle Support ...
DFI
Memory size: 8 GB
COM Express® compact pin-out type 6 Computer-on-Module with Intel® Pentium® / Celeron® Processor N3000 series Up to DDR3L 1600 Memory (2 SODIMM Socket) High speed Interface 2x SATA3 4x USB 3.0/2.0 , +4x USB 2.0
Kontron America
The robust CoreExpress plug connections are an important feature of the Syslogic computer-on-modules (COM boards). In contrast to other COM standards, this connection technology is suitable for heavy-duty industrial use. In addition, ...
Do you have growing requirements in the areas of multimedia and high-speed interfaces? The emCON-MX6 addresses these requirements and offers a long-term availability of up to 15 years. emtrions software specialists also provide ...
emtrion GmbH
COM Express Type 6 Compact Size with Intel® J6412 Processor Specification Form Factor - COM Express® R3.0 Compact Module, Type 6 95W x 95D (mm) CPU - Intel® Celeron® J6412 Processor 10nm, 4 cores, 4 threads, up to 2.60 GHz TDP ...
ARM Cortex-A53 NXP i.MX8M, Small Footprint, System-on-Module. WiFi 802.11ac and Bluetooth 5 communication interfaces. Linux, Android and Yocto source code. Open carrier board specifications, design guides, and schematics. Pre-loaded ...
The VAR-SOM-MX8M-PLUS System on Module / Computer on Module is based on a 1.8GHz Quad Cortex™-A53 NXP’s iMX8M Plus processor with 800MHz Cortex™-M7 Real-time co-processor – a new generation of processors that combine integrated Artificial ...
variscite
COM-HPC Server Size D module based on Intel® Xeon® D processor series (code name "Ice Lake") Industrial Use Condition with extended Temperature options 32 PCIe Express lanes AI Capabilities with Intel® DL boost Real Time Capable Platform Supporting ...
Congatec
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