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Overview The NanoCOM-APL is built around a 6th Generation Intel® Atom™, Celeron®, or Pentium® processor and features onboard LPDDR4 memory with a capacity of up to 8GB. The 7W module’s low power-consumption architecture means it can ...
PICMG COM.0 R3.0 Type 6 module with 45W/25W hexacore and quad-core Intel® processors Up to 96GB* Dual Channel DDR4 at 2133/2400 MHz in up to three SO-DIMM sockets (*under validation) Three DDI channels, one LVDS, supports ...
ADLINK TECHNOLOGY
The Express-CF/CFE is the first COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake-H”) with Mobile Intel® QM370, HM370, CM246 ...
ADLINK TECHNOLOGY
ADLINK introduces its latest COM Express Type 6 modules to fulfill the needs of size, weight, and power (SWaP)-constrained edge computing applications. ADLINK’s cExpress-WL modules feature the 8th generation Intel® Core™ and Celeron® ...
ADLINK TECHNOLOGY
Memory size: 16, 8 GB
Intel® Atom® Processor Amston Lake Series Dual Channel LPDDR5 4800MHz up to 16GB 1 LVDS/eDP, 1 DDI (HDMI/DP++)；Supports dual displays: DDI + LVDS/eDP Multiple expansions: 4 PCIe x1, 1 SMBus, 1 I2C, 1 eMMC Rich I/O: 2 USB 3.1, 8 USB ...
3rd Gen Intel® Xeon® Processor D-1700 Family Dual DDR4 SODIMM 2933MHz up to 96GB (ECC support) Support extended operating temperature: -40 to 85°C 10GBASE-KR: Support up to 4 x 10GbE Mac ports Multiple Expansion: 1 PCIe x16 (Gen4), 2 ...
Memory size: 96 GB
Dual channel DDR4 2666MHz SODIMM up to 96GB Four display ports: VGA*/DDI + LVDS*/eDP + 2 DDI Supports three independent displays DP++ resolution supports up to 4096x2304 @ 60Hz Multiple expansion: 1 PCIe x16, 8 PCIe x1 Rich I/O: 1 Intel ...
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