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Probe cards
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Vertical probe cards enable "multi-die measurement" and "full-wafer measurement," overcoming the limitations of cantilever-type probe cards. Perfect for WL-CSP and FlipChip ...
With multiple lifetime extension options and various security features for the wafer, the ViProbe®II brings all the advantages of the ViProbe® to the next level Min. pitch of the DUT - 50 µm Min. diameter of the plunger - 1,6 mil Max. ...
Feinmetall GmbH
Lamella probes offer various advantages in terms of RF and force requirements. The short length of the probe as well as the flexible amount of lamellae makes it the perfect solution for sophisticated ...
Feinmetall GmbH
Probing WLCSP, SiP or flipchip wafers requires probes withstanding high current while simultaneously assuring high signal integrity. The FEINMETALL FeinProbe® addresses those applications with excellence. Min. pitch ...
Feinmetall GmbH
Customizable to an enormous range of applications and probing materials it is the vertical solution in the market for many years and especially appreciated for its unique simple reparability. Min. pitch of the DUT - 56 µm Min. diameter ...
Feinmetall GmbH
... utilizing FormFactor’s Matrix architecture, HFTAP K32 probe cards can test at speeds that no other full wafer contactor can achieve. The extended capability of FormFactor’s HFTAP K32 probe ...
FORMFACTOR
... Testing these new, high-performance, high-density DRAM devices is optimized with FormFactor’s Matrix and PH-Series wafer probe cards as they improve efficiency and reduce the overall cost of DRAM test. Every ...
FORMFACTOR
... ramps and advanced product roadmaps, this platform extends the production-proven Matrix™ architecture to address increased probe card parallelism in excess of 3000 sites per wafer on a single touchdown. ...
FORMFACTOR
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