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The COMe-bCL6(R E2S) offers increased performance density together with excellent graphic support on a standardized Type 6 Computer-on-Module based on the COM Express basic form factor. Through the use of consistent COM Express connectors ...
Kontron
COMe-bKL6 and COMe-bKL6R E2S deliver a new generation of high performance, feature-rich COM-modules based on the COM Express® basic standard form factor (125 x 95mm) and Intel® 7th Generation Core™ / Xeon® E3 v6 Family processors. These ...
Kontron
The new Kontron COMe-cWL6 (E2S) modules allow up to 48GB of DDR4 memory; optionally they are available with fast NVMe SSD, for the first time in Compact format. The new COMe is also ideally suited for harsh operating conditions in industrial ...
Kontron
COMe-bSL6 and COMe-bSL6R E2S deliver a new generation of high performance, feature-rich COM-modules based on the COM Express® basic standard form factor (125 x 95mm) and Intel® 6th Generation Core™ / Xeon® E3 v5 Family processors. These ...
Kontron
The COMe-cVR6 (E2) deliver a new generation of high-performance, feature-rich Computer-on-Modules based on the standardized COM Express® compact form factor and AMD’s Ryzen Embedded V/R-Series processors. Through the use of consistent ...
Kontron
The Kontron COMe-cBTi6R comes with an especially robust design and is tailored to suit shock- and vibration-proof mobile and stationary applications as well as the extended temperature range of -40°C to +85°C. It is exclusively equipped ...
Kontron
COM Express computer modules are perfect for OEMs designing computing platforms into equipment for industrial or harsh environments, and when reducing the overall design cycle and lowering validation costs are of key importance. Available ...
ADLINK’s COM-HPC-sIDH COM-HPC Server Type Size D module is based on the Intel® Xeon® D-2700 processor and features integrated high-speed Ethernet for up to 8x 10G or 4x 25G combined with 32 PCIe Gen4 lanes for instantaneous responsiveness ...
ADLINK TECHNOLOGY
ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 ...
ADLINK TECHNOLOGY
PICMG COM.0 R3.0 Type 6 module with 45W/25W hexacore and quad-core Intel® processors Up to 96GB* Dual Channel DDR4 at 2133/2400 MHz in up to three SO-DIMM sockets (*under validation) Three DDI channels, one LVDS, supports ...
ADLINK TECHNOLOGY
ADLINK cExpress-TL,based on the 11th Gen Intel® Core™ i7/i5/i3 and Celeron™ processor, is the first COM Express module to support PCI Express Gen 4 at 16 GT/s, effectively doubling the bandwidth of previous generations. Additionally if ...
ADLINK TECHNOLOGY
In-Band ECC error correction 2.5GbE Ethernet, with optional TSN PCIe Gen3 lanes, USB 3.2 10Gbps 3x 4K display Real Time I/O (GPIO, UART, I2C) ADLINK cExpress-EL supports next generation Intel Atom x6000 processors ...
ADLINK TECHNOLOGY
ADLINK’s Express-ID7 COM Express Type 7 Basic Size module is based on the Intel® Xeon® D-1700 processor and features integrated high-speed Ethernet for up to 4x 10G combined with 16 PCIe Gen4 lanes for instantaneous responsiveness and ...
ADLINK TECHNOLOGY
The ADLINK nanoX-EL is a COM Express Type 10 module that supports Intel Atom® x6000 (x6425E, x6413E, x6211E, x6200FE, x6425RE, x6414RE, x6212RE) as well as Intel® Pentium® and Celeron® N and J series processors (formerly Elkhart Lake) ...
ADLINK TECHNOLOGY
VGA and single/dual channel LVDS One PCI, six PCIe x1 and one PCIe x16 (muxed with two DDI channels) One PATA, three SATA 6Gb/s, eight USB 2.0 and one GbE Extreme Rugged operating temperature: -40°C to +85°C (build ...
ADLINK TECHNOLOGY
Single/dual channel 18/24-bit LVDS and VGA Six PCIe x1, one PCI, one PCIe x16 (muxed with DDI channel) Three SATA, one PATA, eight USB 2.0 and GbE Extreme Rugged operating temperature: -40°C to +85°C (selected SKUs) ADLINK ...
ADLINK TECHNOLOGY
SMARC specification 2.1.1 compliant Qualcomm® QRB5165 octa-core SoC Support for up to 6 cameras Up to 8GB LPDDR4, up to 256GB UFS (optional) Dual GbE, 4x PCIe Gen3 lanes, USB 3.1 Real-time I/O (GPIO, UART, ...
ADLINK TECHNOLOGY
Memory size: 16 GB
The COMe-cVR6 (E2) deliver a new generation of high-performance, feature-rich Computer-on-Modules based on the standardized COM Express® compact form factor and AMD’s Ryzen Embedded V/R-Series processors. Through the use of consistent ...
The robust CoreExpress plug connections are an important feature of the Syslogic computer-on-modules (COM boards). In contrast to other COM standards, this connection technology is suitable for heavy-duty industrial use. In addition, ...
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