{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
AI@Edge development system powered by the NVIDIA Jetson Nano™ module Features - NVIDIA Jetson Nano™ - PoE/PD x 1 - 4GB LPDDR4 + 16GB eMMC - USB 3.2 Gen 1 x 4 - M.2 E-key slot x 1 for WiFi function expansion - DC 12 ~ 24V wide ...
AAEON
Overview COM Express Compact Type 6 with 11th Generation Intel® Core™ Processor Family (formerly Tiger Lake UP3) Features -11th Generation Intel® Core™ Tiger Lake-UP3 SoC Processor -2 x SODIMM DDR4 3200MHz Memory, up to 64GB (in-band ...
AAEON
COM Express Type 10 CPU Module with Onboard Intel® Atom™/Celeron®/Pentium®Processor Features - Intel Atom® x6000E,Pentium®, Celeron® series Processor - Onboard Memory LPDDR4, up to 16GB - Intel i226IT 2.5GbE x 1 - 18/24-bit Single ...
AAEON
Qseven 2.1 module based on Intel Atom® E3900, Pentium® and Celeron® processor series Specifications Up to 8 GByte DDR3L (ECC/non ECC)/ onboard LPDDR4 memory down (non ECC) Dual display support (triple display on request) ...
Kontron
The ETX®-LX2 (Embedded Technology eXtended) is a highly integrated and fast Computer-on-Module with extreme low power consumption. It allows, due to the used AMD® LX800 processor, the usage of the board without active cooling in applications, ...
Kontron
Up to 16 GByte LPDDR4 memory down with inband ECC support 2x USB 3.0, 4x USB 2.0, 1x SATA, eMMC onboard, up to 2x LAN onmodule + 1 optional via SERDES TSN support Industrial grade temperature
Kontron
Memory size: 0 GB - 16 GB
SMARC® Rel. 2.1 compliant Computer on Module (CoM) with Intel® Atom® processors x7000E Series, Intel® Core™ i3 processor, Intel® Processors N Series (Codename: Alder Lake N) Video Interfaces - Integrated Intel® UHD Graphics driven ...
SECO S.p.A.
Memory size: 0 GB - 16 GB
SMARC® Rel 2.1 compliant module with Intel Atom® Processors x7000RE Series for the Edge Video Resolution - Up to 4096x2160 @60Hz Audio HD audio and Soundwire / i2S audio interfaces Serial Ports - 2x UARTs 2x HS-UARTs Other ...
SECO S.p.A.
Memory size: 0 GB - 64 GB
COM-HPC® Client Computer on Module (CoM) Size A with 11th Gen Intel® Core™ and Celeron® (formerly Tiger Lake-UP3) Processors Graphics Integrated Iris Xe Graphics Core Gen12 architecture, with up to 96 Execution Units MPEG2, WMV9, ...
SECO S.p.A.
ADLINK’s COM-HPC-cRLS COM-HPC Client Type Size C module is based on 13th Gen Intel® Core™ desktop processor. It features Intel’s advanced hybrid architecture (with up to 8 P-cores and 16 E-cores) along with 16 PCIe Gen5 that provide superior ...
ADLINK TECHNOLOGY
COM Express Compact Size (Type 6) Form Factor Intel® Kaby Lake / Skylake Processor Intel® Kaby Lake / Skylake Core i7/i5/i3 / Celeron ULV processors Intel® vPro technology support 2 x DDR4 SO-DIMM and support up to 32GB Support triple ...
Fanless Design Soldered Onboard Intel® Atom™ Processor E3800 family Intel i210IT PCIe GbE controller Dual Channels 24-bit LVDS, DDI Port Extended Operating Temp.: -20 ~ 70°C
ARBOR Technology Corp.
Memory size: 4 GB
Intel Atom® E3800 Processor Series Rich I/O: 1 Intel GbE, 1 USB 3.0, 8 USB 2.0 Multiple expansions: 3 PCIe x1, 2 SATA 2.0 1 LVDS, 1 DDI (HDMI/DVI/DP) Single Channel DDR3L 1333MHz ECC Memory Down up to 4GB 15-Year CPU Life Cycle Support ...
DFI
Memory size: 2, 4 GB
Rich I/O: 1 Intel GbE, 1 USB 3.0, 6 USB 2.0 Multiple expansions: 3 PCIe x1 1 DDI (DP/HDMI/DVI), 1 LVDS 2GB/4GB DDR3L Single Channel Memory Down 15-Year CPU Life Cycle Support Until Q1' 28 (Based on Intel IOTG Roadmap)
DFI
Memory size: 1, 2 GB
Rich I/O: 1 Intel GbE, 4 USB 2.0, 1 USB OTG Multiple expansions: 1 PCIe x1, 1 SATA 2.0, eMMC 1GB/2GB DDR3 Single Channel Memory Down 15-Year CPU Life Cycle Support Until Q1' 27 (Based on NXP Roadmap)
DFI
Memory size: 8 GB
◼ Compatible with SMARC2.0 and SMARC2.1 ◼ Triple display up to 4K2K (DP++, HDMI, LVDS/eDP) ◼ Dual-channel LPDDR4 has up to 8GB of memory and supports IBECC ◼ Rich I/O extensions include PCIe (gen2), USB3.2 (Gen2), USB2.0, and ...
Features Intel® Atom™ processor (Bay Trail) Onboard DDR3L up to 4GB Max. up to 4 lanes of PCIe 2 SATA-300 8 USB 2.0 and 1 USB 3.0 Introduction The CEM846 COM Express type 10 Mini module is powered by the Intel® Atom™ processor ...
AMD eOntario T40E 1.00GHz CPU (Optional T16R 615MHz or T56N 1.60GHz CPU) AMD A50M Chipset One 204-pin DDR3 SODIMM Socket Supports Up to 4GB DDR3 1066 SDRAM Dual View, 2-CH LVDS, CRT, HDMI 7.1-CH Audio, Dual Gigabit Ethernet ...
Avalue Technology Inc.
Memory size: 64 GB
The new COM–Express® modules, based on 13th Gen Intel® Core™ (former codename Raptor Lake-P) offer a significant performance increase compared to the previous generation and are equipped with up to 14 cores based on Intel® performance ...
Kontron America
The robust CoreExpress plug connections are an important feature of the Syslogic computer-on-modules (COM boards). In contrast to other COM standards, this connection technology is suitable for heavy-duty industrial use. In addition, ...
The VIA ETX-8X90 is a highly-integrated embedded multimedia module with native ISA/PCI support for legacy expansion cards and applications. Powered by a 1.2GHz VIA Nano® X2 E-Series dual core processor and VIA VX900 MSP, the VIA ETX-8X90 ...
VIA Technologies
Features The Intel® ATOM™ N270 and 945GSE platform that provides cost effective solution and technology The Intel® platform brings under 10W TDP solution for easy fan-less design SATA and IDE interface provide best cost effective ...
PORTWELL
The COMeT10-3900 is an industrial COM Express® Type 10 Mini module with an Intel Atom® E3900 processor. This low power, industrial module was designed and manufactured in the USA. The small form factor module is designed as a processor ...
COM Express Type 6 Compact Size with Intel® J6412 Processor Specification Form Factor - COM Express® R3.0 Compact Module, Type 6 95W x 95D (mm) CPU - Intel® Celeron® J6412 Processor 10nm, 4 cores, 4 threads, up to 2.60 GHz TDP ...
The ConnectCore 6 is an ultra-compact and highly integrated system-on-module solution based on the NXP/Freescale i.MX6 Cortex-A9 processor family. With processor speeds up to 1.2 GHz and fully pin-compatible single-/dual-/quad-core ...
Digi International
Memory - LPDDR4X-3200, 2GB, on board Storage - 1*eMMC 8/16/32G 2*SATA 3.0, 1*TF Card Slot Expansion Interface - 1*Mini-PCIe (Wifi/3G/4G supported) 1*M.2 (Key-B, PCIe 3.0/ PCIe 2.0/ USB 3.0/ SATA, 2242/3052) System - Android, ...
NXP i.MX8M computer-on-moduleSPEAR-MX8
The SPEAR-MX8 is a highly scalable System on Module / Computer on Module provides an ideal solution for embedded products requiring advanced performance processing, high-end graphic, UltraHD video capabilities and a variety of high-speed ...
variscite
COM-HPC Server Size E module based on Intel® Xeon® D processor series (code name "Ice Lake") Industrial Use Condition with extended Temperature options 48 PCIe Express lanes AI Capabilities with Intel® DL boost Real Time Capable ...
Congatec
Neptune: EPIC format CPU with integrated autocalibrating analog I/O, digital I/O and DC/DC power supply Neptune introduces a new concept in small form factor embedded SBCs. The CPU core consists of an ETX module which mounts on the ...
Please specify:
Help us improve:
remaining