Scribing lasers

Power: 50, 200 W
Wavelength: 343, 1,030 nm

... Wafer Scribing and Dicing • Medical Device Processing • Solar/PV Scribing and Drilling • Ceramics Processing • Fine Metal Processing • Polymer Cutting The IceFyre FS family is an extraordinary ...

Power: 150 W - 500 W
Wavelength: 9,400, 10,200, 10,600 nm

... zone, plus compact, fully sealed, slab discharge construction for enhanced reliability and low cost-of-ownership. Utilize lasers featuring common mechanical, electrical, optical, software, and control interfaces for ...

Power: 70 W - 80 W
Wavelength: 9.2 µm - 10.8 µm

Water-cooled short-cavity CO₂ laser, power range 70W—80W, wavelength 9.2—10.8μm, input DC power 48V/30A. Short resonant cavity, beam shaping system inside the cavity, good laser stability, quasi-fundamental ...

Power: 20, 30 W
Wavelength: 1,064 nm

M7 20W/30W Application Advantages Scribing, Drilling Surface treatment Sheet metal cutting, Welding Marking on fly Metal surface processing, Peeling coating JPT M7 series high power pulsed fiber lasers ...

Laser: 532nm GRN Wavelength Laser Wafer Size: 2″ And 4″; 6″ available as an option Transparent LED Wafer SD Scribing, etc. Low-leakage Current Programmable Scribing ...

Power: 30, 100, 300 W
Wavelength: 10.2 µm

Comexi Laser is the revolution of the flexible packaging industry. A laser-in-line processing system that can be integrated into any of our slitters. The key technology to make a difference and optimize ...