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Working width: 5 mm - 200 mm
It is mainly used for double-sided lapping and polishing of metal, non-metal, sapphire, and semiconductor materials, with air bag pressure and disc cooling function
... polish for TOPCon, BC, HJT high-efficiency solar cells Used for polishing, etching and cleaning treatment Nano-bubble cleaning to achieve efficient cleaning of the surface of silicon wafer With ...
... including Gallium Arsenide, Silicon, Rock and Soils. The PM6 machine is used extensively in: The preparation of Geological Thin Sections: i.e. Rock lapping system The preparation of Semiconductor ...
These series machines are two-axis high-precision single side polishing machines, the polishing head can rotate, swing and work in the high-pressure and high-speed condition, ...
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