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... pins • unmated stacking height: 4.85 mm • EMC shielding • SMT • Performance level 1 Basics Performance Level IEC 60512-9-1:2010 - 1 No. of Contacts - 12 Termination Technology - SMT Board-to-Board ...
ept
... pins • unmated stacking height: 4.85 mm • EMC shielding • SMT • Performance level 1 Basics Performance Level IEC 60512-9-1:2010 - 1 No. of Contacts - 20 Termination Technology - SMT Board-to-Board ...
ept
... pins • unmated stacking height: 4.85 mm • EMC shielding • SMT • Performance level 1 Basics Performance Level IEC 60512-9-1:2010 - 1 No. of Contacts - 32 Termination Technology - SMT Board-to-Board ...
ept
... 20 pins • unmated stacking height: 10.85 mm • EMC shielding • SMT • Performance level 1 Performance Level IEC 60512-9-1:2010 - 1 No. of Contacts - 20 Termination Technology - SMT Board-to-Board ...
ept
• 12 pins • right angled • EMC shielding • SMT • Performance level 1 Performance Level IEC 60512-9-1:2010 - 1 No. of Contacts - 12 Termination Technology - SMT Insulator Material - LCP, UL ...
ept
• 20 pins • right angled • EMC shielding • SMT • Performance level 1 Basics Performance Level IEC 60512-9-1:2010 - 1 No. of Contacts - 20 Termination Technology - SMT Material Insulator ...
ept
• 32 pins • right angled • EMC shielding • SMT • Performance level 1 Basics Performance Level IEC 60512-9-1:2010 - 1 No. of Contacts - 32 Termination Technology - SMT Material Insulator ...
ept
• 80 pins • right angled • EMC shielding • SMT • 0.8 mm pitch • Performance level 1 Basics Performance Level IEC 60512-9-1:2010 - 1 No. of Contacts - 80 Termination Technology - SMT Operating ...
ept
• 12 pins • unmated stacking height: 4.85 mm • SMT • Performance level 1 Basics Performance Level IEC 60512-9-1:2010 - 1 No. of Contacts - 12 Termination Technology - SMT Board-to-Board Distance ...
ept
• 20 pins • unmated stacking height: 4.85 mm • SMT • Performance level 1 Basics Performance Level IEC 60512-9-1:2010 - 1 No. of Contacts - 20 Termination Technology - SMT Board-to-Board Distance ...
ept
Open top THT socket solution for QFN packages with 0.50 mm pitch Centre signal contacts (electrical) available for exposed pads Suitable for packages up to 1.00 mm thick Cantilever stamped contact type structure Squared ...
Yamaichi Electronics
Open top THT socket solution for QFN packages with 0.40 mm and 0.50 mm pitch Suitable for package outline size in the range 4 - 8 sqmm and 0.70 - 1.30mm thickness Active alignment for IC package positioning Cantilever ...
Yamaichi Electronics
Clamshell CMT solution Suitable for BGA and LGA packages with 0.40 mm pitch U-shape or double bow contact structure Compact solution suitable in manual applications Suitable for different kind of depopulation Stamped contact type Mating ...
Yamaichi Electronics
Semi-custom clamshell CMT socket solution suitable for BGA, CSP, QFN, SON, LGA packages IC package dimensions from 2 x 2 to 10 x 10 sqmm Pitch from 0.30 mm to 1.30 mm standard, staggered or irregular ability to support ...
Yamaichi Electronics
... . 0.50mm to 1.27mm pitch. Solutions to obsolescence for most SMT or thru-hole lead styles. Sourcing and device attach for passive and active components. Stand-offs, solder preforms, SMT designs, and more.
... Board Familytype - Input/Output Technology - D Sub Pitch - Others Smt - no Number of circuits - 9, 15, 25, 37 Applicable wire - AWG #28 to #20 Compliant with rohs The socket contacts are highly ...
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