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... 14), 5 eject tools •Stamping tools and calibration tools possible •Die attach, flip chip and multi-chip in one machine •Die pick from: wafer, waffle pack, Gel-Pak®, feeder •Die ...
BE Semiconductor Industries N.V.
... Bad mark search •Pre-defined fiducial geometry & customized teaching •Die Attach and Multi-Chip in one machine •Die pick from: wafer, waffle pack, Gel-Pak®, feeder •Die place ...
BE Semiconductor Industries N.V.
... down-time prevention caused by flux • Trajectory controlled heating and cooling • New thermal stress resistant tool holder - Tilt • Accurate temperature calibration station Optimized ...
BE Semiconductor Industries N.V.
The BL100 is a table-top die bonder. It comes in a compact design with a footprint not much larger than a typewriter. It can be operated by seating personnel for best performance of the manual tasks within ...
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