{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
{{product.productLabel}} {{product.model}}
{{#if product.featureValues}}{{product.productPrice.formattedPrice}} {{#if product.productPrice.priceType === "PRICE_RANGE" }} - {{product.productPrice.formattedPriceMax}} {{/if}}
{{#each product.specData:i}}
{{name}}: {{value}}
{{#i!=(product.specData.length-1)}}
{{/end}}
{{/each}}
{{{product.idpText}}}
... 200 is an economical gap filling material. It offers moderate thermal conductivity and compressibility. It is an ideal solution for cost-sensitive applications. TCR 200 is RoHS compliant, halogen free and electrically ...
Schlegel Electronic Materials
OP-8100 is a gap filling material suitable for cost sensitive applications. It is electrically non-conductive and offers moderate thermal conductivity and compressibility. The proprietary formulation ...
Schlegel Electronic Materials
OP-8200 is an economical freestanding gap filling material. It offers moderate thermal conductivity and compressibility. It is an ideal solution for cost-sensitive applications. OP-8200 is RoHS compliant and halogen-free, ...
Schlegel Electronic Materials
GF400 is a two part, liquid silicone based gap filler, which provides excellent thermal performance. GF400 thermal gap filler is a two part, liquid silicone based ...
The product features a very delicate and sterile thermal conductive pad. The product is very fine and the conformity helps lessen the heat resistance and strain on demanding devices in electronics like cellphones and ...
... provides exceptional contouring and excellent cushioning performance. These defining features ensure that SoftFlex Gap Fillers are ideal for dealing with uneven surfaces, parts with varying heights ...
The H series, which is manufactured by Shenzhen HFC Shielding, is a thermal pad that is ideal for use in power conversion components, in high-speed disk storage drives, and in engine control units. The series has an adequate compression ...
Shenzhen HFC Co.,Ltd
The phase change materials " PCM" are used to minimize the thermal resistance between the component and a radiator (total wet-out). Easy to apply at room temperature, it will soften when the component temperature will be between 50 ° ...
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