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USB 3.1 computer-on-modules
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COM Express® Basic V2000 with AMD Embedded V-Series high-performance “Zen2” CPU Specifications Up to 64 GByte DDR4 memory (2x 32 GByte dual-channel DDR4 SO-DIMM) Up to 8 PCIe lanes (4x PCIe 3.0 (up to 8 GT/s) 4x PCIe 2.0 ...
Kontron
The COMe-mEL10 (E2) is a credit card sized Computer-on-Modules platform based on the Intel® Atom® x6000 Series, Pentium® and Celeron® processors. The COMe-mEL10 (E2) performance range of COM Express mini modules is highly scalable ...
Kontron
Up to 48 GByte DDR4 memory (16 GByte DDR4 memory down) Up to 2.5 Gb Ethernet with TSN support Optional NVMe SSD onboard Industrial grade versions
Kontron
COM Express computer modules are perfect for OEMs designing computing platforms into equipment for industrial or harsh environments, and when reducing the overall design cycle and lowering validation costs are of key importance. Available ...
Memory size: 12 GB
SMARC® 2.1.1 module with Qualcomm® QCS5430 processor Cpu 2x Arm® Cortex®-A78 @2.4 GHz, 4x Arm® Cortex®-A55 Memory Soldered-down LPDDR5-6400 memory, up to 12GB total, 32-bit interface 2 channels Graphics Qualcomm® Adreno™ 642L Video ...
SECO S.p.A.
Memory size: 0 GB - 8 GB
SMARC® Rel. 2.1.1 Computer on Module (CoM) with MediaTek Genio 700 Applications Processors Audio - 2x I2S port Serial Ports - 2x UART (4-wires) 2x UART (2-wires) Other Interfaces - GPIOs MIPI-CSI camera interface General ...
SECO S.p.A.
Memory size: 0 GB - 8 GB
SMARC® Rel. 2.1.1 module with MediaTek Genio 510 Applications Processors Graphics Mali-G57 MC2 GPU Audio 2x I2S port Serial Ports 2x UART (4-wires) 2x UART (2-wires) Other Interfaces - GPIOs MIPI-CSI camera ...
SECO S.p.A.
An advanced System On Module (SOM) solution is now available from ARBOR Technology designed to accelerate the development of IoT applications. The SM1200 is capable of driving 4K displays and multiple touch screens and supports the ...
SMARC specification 2.1.1 compliant Qualcomm® QRB5165 octa-core SoC Support for up to 6 cameras Up to 8GB LPDDR4, up to 256GB UFS (optional) Dual GbE, 4x PCIe Gen3 lanes, USB 3.1 Real-time I/O (GPIO, UART, ...
Memory size: 16, 8 GB
Intel® Atom® Processor Amston Lake Series Dual Channel LPDDR5 4800MHz up to 16GB 1 LVDS/eDP, 1 DDI (HDMI/DP++);Supports dual displays: DDI + LVDS/eDP Multiple expansions: 4 PCIe x1, 1 SMBus, 1 I2C, 1 eMMC Rich I/O: 2 USB 3.1, 8 USB ...
DFI
Intel® Atom® Processor Elkhart Lake Series Dual Channel LPDDR4X 3200MHz/4267MHz up to 16GB 1 LVDS/eDP, 1 DDI (HDMI/DP++);Supports dual displays: DDI + LVDS/eDP Multiple expansions: 4 PCIe x1 Rich I/O: 1 Intel GbE, 4 USB 3.1, 8 USB 2.0 15-Year ...
DFI
AMD® Ryzen™ R1000 Series Processor Single Channel LPDDR4 2400MHz;Memory Down up to 8GB 1 LVDS/eDP, 1 DDI (HDMI/DP);Supports dual displays: DDI + LVDS/eDP Multiple expansions: 3 PCIe x1 Rich I/O: 1 Intel GbE, 2 USB 3.1, 8 USB 2.0 10-Year ...
DFI
Memory size: 16 GB
The COMe-cVR6 (E2) deliver a new generation of high-performance, feature-rich Computer-on-Modules based on the standardized COM Express® compact form factor and AMD’s Ryzen Embedded V/R-Series processors. Through the use of consistent ...
Kontron America
The COMeT10-3900 is an industrial COM Express® Type 10 Mini module with an Intel Atom® E3900 processor. This low power, industrial module was designed and manufactured in the USA. The small form factor module is designed as a processor ...
COM Express Type 6 Basic module based on 11th Generation Intel® Core™ processor family (code name "Tiger Lake-H") Embedded/Industrial use condition Extended temperature options available PCI Express Gen 4 AI/DL Instruction Sets including ...
Congatec
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