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- Wafer handling positioning system
Wafer handling positioning systems
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Repeatability: 1.5 µm - 3.5 µm
Load: 663 g
Stroke: 40 mm
... in the three lateral directions • Repeatability up to 1.5 µm The XYZ positioning system is a cartesian oriented positioning system consisting of three miniature linear ...
Repeatability: 2.3 µm - 4.5 µm
Load: 4.5 kg
Stroke: 50 µm - 50 µm
... compact 3-axis alignment system with screw drive and DC or stepper motor can be easily controlled using our FMC series controllers. With the appropriate commissioning software FMC Quick, the system ...
Repeatability: 5 µm
Load: 30 kg
Stroke: 300 mm
Open-frame XY stages designed with a low profile for a wide range of automated accurate positioning in microscope-based applications. The drive mechanism located on the side of the unit and offers a clear ...
Repeatability: 5, 10 µm
Load: 4 kg - 25 kg
Speed: 0.1 m/s - 10 m/s
... repeatability, at even higher dynamics. With embedded support to proper sample alignment, the module then allows further control of wafers planarity, with respect to equipment heads, by means of its additional ...
Repeatability: 1.5, 5.5 µm
Stroke: 76 mm
Speed: 50 mm/s
... high-precision positioning system has been specifically designed as a complementary polarization filter for miniaturization and automation in EUV lithography. It maximizes the exposure quality as well ...
Steinmeyer Mechatronik GmbH
Repeatability: 1.5, 2.5 µm
Stroke: 50, 150 mm
Speed: 25 mm/s
XY theta alignment of UV exposure masks | High-precision positioning system for wafer exposure in dry nitrogen atmosphere Precision Assemblies 786001:002.26 XY theta ...
Steinmeyer Mechatronik GmbH
Repeatability: 1.5, 2.5 µm
... imaging in extremely dry environment • Specifically developed to maximize yield and resolution of wafer stepper systems • Simultaneous positioning of lenses to each other as well ...
Steinmeyer Mechatronik GmbH
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