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Power: 0 W - 5 W
... is applicable to 8-inch and above wafers. • Picosecond light sourceis used, good effect Picosecond light source is used to mark / code on the material surface, with small thermal impact and good effect • Marking ...
Power: 5 W
X travel: 150 mm
Y travel: 150 mm
... semiconductor industry, the wafer manipulator and external coaxial vision positioning technology are adopted to realize the full-automatic laser marking of 2-6 inch wafers. Product ...
Power: 20 W
X travel: 200 mm
Y travel: 200 mm
... polycrystalline silicon solar battery (cell) and silicon (wafer) of scribing processing (cutting section). Perfect Laser produced a new generation of 20w 50W Solar cell fiber cutting machine mainly ...
Power: 20 W
X travel: 200 mm
Y travel: 200 mm
... Full-enclosed Type Fiber laser silicon wafer cutting machine with Dust-proof PE-20W/50W (II), the biggest difference between the first generation is that this laser scribe machine is ...
Power: 10, 7, 5, 3 W
X travel: 150, 300, 200, 110 mm
Y travel: 150, 200, 300, 110 mm
... industrial working condition. It can be integrated on production line marking for production date, S/N number etc. It can mark and engrave all materials. Suntop Laser UV laser marking ...
Power: 3 W
X travel: 110 mm - 175 mm
Y travel: 110 mm - 175 mm
... textiles, chips, ceramics, semiconductor wafers, IC chips, sapphire, polymer films and other special materials marking, cutting and processing, such as metal marking, plastic marking, ...
Power: 10 W
X travel: 70 mm
Y travel: 70 mm
... materials, marking faster and finer. The mini laser marker supports handheld marking, the laser module is easy to install, and is suitable for marking large-sized objects. Equipped with ...
Power: 30 kW
X travel: min 110.0 mm
Y travel: min 110.0 mm
... Fibre-optic three-dimensional laser marking machine (visual positioning marking machine) laser marking machine using visual technology, equivalent to ...
Power: 175 W
X travel: 175 mm
Y travel: 175 mm
... Fiber/CO2/3W 5W UV Laser Marking Machine/Laser Printer/3D Logo Printing Machine/Laser Engraving Machine for Metal/Jewelry/Plastic/Glass It can provide stable power ...
Power: 3 W - 100 W
X travel: 175 mm
Y travel: 175 mm
... durable than 20w , and 50w is more durable than 30w 2:if marking same content on same materials, 50w marking speed is faster than 20w/ 30w 3:if marking same depth on same material, ...
... standard CAD line fonts, customizable extensions. 8. Production line speed /minimum marking line width:＜80m/min / 0.04mm 9. Marking line/ Character size:Adjustable in marking ...
Power: 3, 5, 10, 15 W
X travel: 110, 150, 200 mm
Y travel: 100, 150, 200 mm
The mini fiber laser marking machine offers a complete solution for fast speed marking and high precision on metal and some nonmetal materials such as some hard plastics.The mini fiber laser marking ...
High Precision 2DBC Laser-marking Machine designed and customized for specific wafer or FPC Software developed & tailor-made to suit end-user requirements 2DBC generated by and ...
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