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Working width: 5 mm - 200 mm
It is mainly used for double-sided lapping and polishing of metal, non-metal, sapphire, and semiconductor materials, with air bag pressure and disc cooling function
... is used for polishing, etching and cleaning treatment of diffused wafers and also compatible for texturing and cleaning treatment of bifacial solar cells. · Throughput: 400pcs/batch, 8000pcs/h. · ...
These series machines are two-axis high-precision single side polishing machines, the polishing head can rotate, swing and work in the high-pressure and high-speed condition, ...
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