Laser micro-machining machine microDICEfor the semiconductor industry
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Characteristics
- Type
- laser
- Applications
- for the semiconductor industry
- Positioning accuracy
0.001 mm, 0.0018 mm
(0.00004 in, 0.00007 in)- Repeatability
0.0004 mm, 0.00075 mm
(0.00002 in, 0.00003 in)
Description
Cost, quality, and throughput are major factors of success for SiC based devices in the semiconductor industry. 3D-Micromac answers this challenge with its brand-new microDICE™ system.
The revolutionary, high-performance microDICE™ laser dicing system brings TLS-Dicing™ technology (Thermal-Laser-Separation) to semiconductor‘s back-end.
The microDICE™ separates wafers, including SiC, into dies with an outstanding edge quality while increasing the yield and the throughput.
Catalogs
microDICETM
4 Pages
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.