A cost effective solution for challenging power density applications
Are you under pressure to cool electronics with progressively higher heat density and reduced spaces but at the same time improve performance? In today’s most demanding applications liquid cooling has become the choice of designers striving to manage the rising heat loads of high power electronics. Whether it’s lasers, power generation and conditioning, medical equipment, transportation or military electronics, Liquid Cold Plates (LCPs) offer performance advantages over air cooled solutions in high watt density applications.
In particular, the AavBlister liquid cold plate represents an important innovation in cold plate design. In this full aluminum construction, blister technology stamps channels into the cover plate eliminating base plate machining and greatly lowering manufacturing costs. The blister channels allow greater flexibility to drill mounting holes in the under-side of the heat sink without regard for the location of the liquid channels. Offset fin structures enhance thermal transfer performance.
Many companies that produce electronics or machinery are hesitant about using water- cooled systems for electronic circuits; Aavid’s liquid cold plates are 100% leakage and pressure drop tested during production, thereby overcoming any doubt you may have about reliability.
Download our brochure to find out more about Blister Liquid Cold Plates, test it out by purchasing one of our standard models via our Estore or contact us for assistance in designing a custom solution to respond to your specific needs.