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COM-HPC computer-on-module COM-HPC-sIDH
Intel® Atom D2700EthernetMini PCIe

COM-HPC computer-on-module
COM-HPC computer-on-module
COM-HPC computer-on-module
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Characteristics

Form factor
COM-HPC
Processor
Intel® Atom D2700
Ports
Ethernet, Mini PCIe
Other characteristics
rugged

Description

ADLINK’s COM-HPC-sIDH COM-HPC Server Type Size D module is based on the Intel® Xeon® D-2700 processor and features integrated high-speed Ethernet for up to 8x 10G or 4x 25G combined with 32 PCIe Gen4 lanes for instantaneous responsiveness and performance. Equipped with Intel® TCC, Deep Learning Boost (VNNI), and AVX-512 technologies for optimal, accelerated AI performance, and support for Time Sensitive Networking (TSN), it offers precise control for hard-real-time workloads across all networked devices. Built for edge and rugged AI applications, this new ADLINK COM with Intel® Ice Lake-D empowers system integrators to realize all of their IoT innovations, from unmanned aerial vehicles, autonomous driving, robotic surgery, to rugged HPC servers, 5G base stations, automatic drilling, ship management, and more. Specifications: Intel® Xeon® D-2700 processor Up to 20 cores, 30MB cache 8x 10G or 4x 25G Ethernet 32 PCIe Gen4, 16 PCIe Gen3 lanes Intel® AVX-512 VNNI, Intel® DL Boost Up to 512GB DDR4 support Dedicated PCIe and IPMB for remote management 12V voltage input

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