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COM Express computer-on-module Express-RLP series
13th Generation Intel® Core™VGArugged

COM Express computer-on-module - Express-RLP series - ADLINK TECHNOLOGY - 13th Generation Intel® Core™ / VGA / rugged
COM Express computer-on-module - Express-RLP series - ADLINK TECHNOLOGY - 13th Generation Intel® Core™ / VGA / rugged
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Characteristics

Form factor
COM Express
Processor
13th Generation Intel® Core™
Ports
VGA
Other characteristics
rugged

Description

ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor (formerly codenamed Raptor Lake-P) and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade/real-time option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP. The module provides support for PCIe 4.0 and DDR5 memory with up to 4800 MT/s, 4 display or USB4/TBT4, and features integrated Intel® Iris Xe graphics with up to 96EUs, allowing for instantaneous on-device AI performance. Equipped with Intel® TCC (Time-Coordinated Computing) and TSN (Time Sensitive Networking) support, the Express-RLP ensures timely execution of deterministic, hard real-time workloads with ultra-low latency, making it well suited for mission-critical AIoT use cases, including industrial automation, AMR (Autonomous Mobile Robot), autonomous driving, medical imaging, video broadcasting, and more. Specifications: Up to 14 cores (6 P-cores and 8 E-cores), 20 threads Intel® AVX-512 VNNI, Intel® DL Boost Intel® Iris® Xe graphics 4x displays via DDI/LVDS (optional eDP, VGA) or 2x USB4/TBT4 Up to 64GB DDR5, in-band ECC, at up to 4800 MT/s 16x PCIe Gen4, 5x PCIe Gen3 lanes 2.5GbE, Intel® TCC, TSN capable Extreme rugged operating temperature option

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