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COM Express computer-on-module Express-CF series
PICMG8th Generation Intel® Core™Intel® Core™ i3-8100

COM Express computer-on-module - Express-CF series - ADLINK TECHNOLOGY - PICMG / 8th Generation Intel® Core™ / Intel® Core™ i3-8100
COM Express computer-on-module - Express-CF series - ADLINK TECHNOLOGY - PICMG / 8th Generation Intel® Core™ / Intel® Core™ i3-8100
COM Express computer-on-module - Express-CF series - ADLINK TECHNOLOGY - PICMG / 8th Generation Intel® Core™ / Intel® Core™ i3-8100 - image - 2
COM Express computer-on-module - Express-CF series - ADLINK TECHNOLOGY - PICMG / 8th Generation Intel® Core™ / Intel® Core™ i3-8100 - image - 3
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Characteristics

Form factor
COM Express, PICMG
Processor
8th Generation Intel® Core™, Intel® Core™ i3-8100
Applications
industrial, medical, military

Description

The Express-CF/CFE is the first COM Express® COM.0 R3.0 Basic Size Type 6 module supporting the Hexa-core (6 cores) 64-bit 8th Generation Intel® Core™ and Xeon® processor (codename “Coffeelake-H”) with Mobile Intel® QM370, HM370, CM246 Chipset. Whereas previous generations Intel® Core™ i3 processors supported only dual cores with 3MB cache, the Intel® Core™ i3-8100H is the first in its class to support 4 CPU cores with 6MB of cache. This major upgrade results in a more than 80% performance boost in MIPS (million instructions per second), and an almost doubling of memory/caching bandwidth, all at no significant cost increase compared to earlier generations. Intel® Core™ i3 processors are widely recognized as the best valued processor and are therefore preferred in high-volume, cost-sensitive applications. They are popular choices in gaming, medical and industrial control to name a few. These Hexa-core processors support up to 12 threads (Intel® Hyper-Threading Technology) as well as an impressive turbo boost of up to 4.4GHz. These combined features make the Express- CF/CFE well suited to customers who need uncompromising system performance and responsiveness in a long product life solution. The Express-CF/CFE has up to three SODIMM sockets supporting up to 48GB of DDR4 memory (two on top by default, one on bottom by build option) while still fully complying with PICMG COM.0 mechanical specifications. Modules equipped with the Xeon® processor and CM246 Chipset support both ECC and non-ECC SODIMMs. Integrated Intel® Generation 9 Graphics includes features such as OpenGL 4.5, DirectX 12/11, OpenCL 2.1/2.0/1.2, Intel® Clear Video HD Technology

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