BGA socket F series

Ball Grid Array (BGA) Socket Adapter Systems are an economical solution for device validation and development when soldering the IC to a printed circuit board (PCB) is not practical. The low insertion force design facilitates easy device replacement or field repair in production applications - eliminating the time, cost, and potential board damage caused by desoldering devices. The Solder Ball Advantage Advanced's exclusve solder ball terminal design provides a stronger solder joint while compensating for minor coplanarity issues on the PC board surface. In addition to greater elasticity, solder balls provide more solder on each joint than less-effective solder bump terminal designs, ensuring a reliable connection.