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Cathodic for thin-layer deposition sputtering target

cathodic for thin-layer deposition sputtering target
cathodic for thin-layer deposition sputtering target
cathodic for thin-layer deposition sputtering target
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cathodic for thin-layer deposition

Description

We utilize a variety of specialized processing techniques such as hot pressing, hot isostatic pressing (HIP), cold isostatic pressing (CIP), induction vacuum melting, and vacuum casting to produce homogenous, fine-grained, high-density materials that conform to the strictest application standards. All sputtering targets are cleaned, inspected, chemically-tested, and packed under inert gas for immediate use in your vacuum system. Angstrom Sciences provides a full range of sputtering target materials including: precious metals, pure metals, alloys, ceramics, cermets, borides, oxides, carbides, nitrides, silicides, and fluorides. Purities range from commercial grade (99.5%) to ultra high (99.9999%).

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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.