RedHawk-SC is the proven, trusted industry leader for power noise and reliability signoff for digital IP and SoCs down to 3nm and built on cloud-native elastic compute infrastructure.
Comprehensive IR Drop and Electromigration Signoff Solution for Digital IP and SoCs
Ansys RedHawk-SC is the industry’s trusted gold standard voltage drop and electromigration multiphysics sign-off solution for digital designs. Its powerful analytics quickly identify any weaknesses and allow what-if explorations to optimize power and performance. Redhawk-SC’s cloud-based architecture gives it the speed and capacity to handle full-chip analysis. Signoff accuracy is certified by all major foundries for all finFET nodes, down to 3nm.
Timing Impact of IR-Drop with Path FX
ESD Solution with PathFinder
Thermal and 3DIC with Electrothermal Option
Interoperable with Ansys Board/System Tools
Quick Specs
Ansys RedHawk-SC enables robust, low-power digital designs without performance loss thanks to advanced power analytics that give designers comprehensive techniques to detect and correct dynamic voltage drop .
RedHawk-SC is integrated with all major EDA implementation flows as well as Ansys RedHawk-SC Electrothermal™ for 3DIC co-simulation, Ansys Path FX for vatriability-aware timing analysis, and Ansys PathFinder™ for electrostatic discharge analysis.
Dynamic & Static Power
Power & Signal Electromigration
Vector & Vectorless Activity
Timing Impact of IR-Drop
Chip/Package Co-optimization
Power Grid Robustness Metrics
Thermal-Aware EM
Near-Linear Cloud Scalability