Design software Icepak

managementanalysisCFD

Ansys Icepak is a CFD solver for electronics thermal management. It predicts airflow, temperature and heat transfer in IC packages, PCBs, electronic assemblies/enclosures and power electronics. Electronics Cooling & PCB Thermal Simulation and Analysis Ansys Icepak provides powerful electronic cooling solutions that utilize the industry leading Ansys Fluent computational fluid dynamics (CFD) solver for thermal and fluid flow analyses of integrated circuits (ICs), packages, printed circuit boards (PCBs) and electronic assemblies. The Ansys Icepak CFD solver uses the Ansys Electronics Desktop (AEDT) graphical user interface (GUI). Unstructured, Body-fitted Meshing Comprehensive Thermal Reliability Solution High-fidelity CFD Solver Industry Leading Multiscale Multiphysics Product Specs Perform conduction, convection and radiation conjugate heat transfer analyses, with many advanced capabilities to model laminar and turbulent flows, and species analysis including radiation and convection. MCAD and ECAD Support Solar radiation Parametrics and Optimization Customization and Automation Network Modeling DC Joule Heating Analysis Electro-thermal and Thermo-Mechanical Extensive Libraries for Thermal Liquid Cooling Dynamic Thermal Management Varying Flow and Power ROM