Soldering hot plate GF-DL-HTaluminumdigital
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Characteristics
- Applications
- soldering
- Material
- aluminum
- Other characteristics
- digital
Description
Reflow hot plate used for a variety of heating applications which include preheat, rework, reflow and curing of printed circuit board assemblies. The GF-DL-HT is capable of lead and lead free, high temperature applications and has dual programmable, digital temperature controllers for precise temperature regulation.
3/4" (19mm) thick aluminum heat plates for precise, even heating
Temperatures up to 315°C (600°C) for soldering with lead-free solder alloys
Lead and Lead-free compatible
CE compliant
RoHS compliant
Catalogs
*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.