Polishing wheel
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Description
Chemical Mechanical Polishing (CMP) helps smooth wafer surfaces, an important part of VLSI (Very-Large-Scale Integration) production. Conditioning is essential to assure stable CMP grinding. Asahi Diamond offers a variety of CMP conditioners to suit diverse wafer shapes and specifications.
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*Prices are pre-tax. They exclude delivery charges and customs duties and do not include additional charges for installation or activation options. Prices are indicative only and may vary by country, with changes to the cost of raw materials and exchange rates.