Electronic sintering SilverSAM™

industrial

A Sintering innovation for power electronics, SilverSAM™ delivers an oxidation-free copper-friendly environment, while designed with a film-assisted sintering process to protect the device against damage. Capable of handling multiple substrate formats, the SilverSAM™ is also applicable for interconnections and expandable volume in productivity. Features •Oxidation-free copper-friendly environment •Sintering / Handling •Multiple substrate format •Master card panel (5” x 7”) DBC / AMB •Singulated DBC / AMB •Wafer level •Leadframe power discrete •Applicable for interconnections •Die attach sinter •Die top sinter clip / DTS (DBB) / Flexible circuit •Substrate to heat sink sinter •Expandable volume in productivity •1 Press → 2 Presses → 3 Presses