Wafer printing machine HYCON XW

inkjetautomatic

The flexible machining cell is designed for front or back side printing (bumping or wafer backside coating) on round wafers. The system consists of two main modules, a loading unit and a printing system. The loading unit in turn consists of three components: a magazine unloading system, a robot unit and a pre-align station. The magazine unloading system is equipped with two magazine positions from where the wafers are fed to the machine. The 3-axis robot unit with vacuum end effector ensures a stress-free wafer transport. Using a flexible pick-up, different end effectors can be used even for very thin or curved wafers. After taking a wafer from the magazine, it is placed re-positioned in the built-in pre-align station via flat or notch recognition for subsequent printing. The wafer is then place by the wafer robot into a vacuum printing nest and then lowered and fixed. After transporting the printing table into the printer, the fiducials are detected by the moving camera and the screen or stencil is fine-adjusted. Printed wafers can now be transported back to a magazine or removed individually with a drawer system. Optionally, processed wafers can also be fed automatically to other machines by a transport system. Subsequent process steps, such as heat treatment, can optionally be integrated in or on the loading cell. OCR or camera reading systems are available for identification of any text on the wafers or 1D/2D codes. Communication of the cell through the SECS-GEM protocol or connection to custom MES systems is possible as options.