Aurel ALS200 CO2 Laser System is designed for high accuracy scribing, drilling and cutting of ceramics substrates for thin and thick film hybrid circuits up to 6″ x 6″ (typical Al2O3 and AIN).
The System is equipped with double nozzle (automatic switching): one for cutting and one for scribing.
ALS200 lasers are offered as basic system or with optional handling modules from/to stack or cassette magazine for high volume production.
Some applications for electronic and general industrial purposes are:
Cutting
Cutting of ceramic substrates
Scribing
Scribing of ceramic substrates
Drilling
Drilling of ceramic substrates
CONTROL SYSTEMS
The machine is PC controlled and allows a great deal of flexibility on all functions
Windows © Operating System
Wide screen monitor and industrial keyboard
Menù program for cutting, drilling and scribing (linear and circular interpolation)
Machine diagnostic
Machine hood & lifting and locking safety switches
Work recipes storing and data logging
One fixed head with double nozzle
Motorized focus to adjust the Z-axis according to the substrate thickness
High resolution Camera for work area vision with crosshair for manual alignment of the substrates
LASER SOURCE
High power semisealed CO Laser 350-1000W type 2 RF333
Gas CO plasma tubesmounted on a frame with a 2 granite plane to ensure high output power stability
RF excitement technology, high peak power, high frequency modulation, compactness
Factory service free with easy gas cartridge replacement
Frequency and pulse width programmable and real-time controlled by the electronic control