Apply to high speed signal PCB transmission of RRU, AAU, BBU.
Press-fit structure;
92Ω matched differential impedance to strength signal integrity;
Apply to high speed data transmission between mother plate and daughter plate;
56Gbps speed rate can increase to 112Gbps PAM4, 25Gbps line speed.
Crosstalk - under 28 GHz, near-end crosstalk≤-35dB, far-end crosstalk≤-35dB
Data transmission speed - 56Gbps
Inserting loss - under 28 GHz, insertion loss >-3dB
Low level contact resistance -
the shortest differential pair≤ 25mΩ;
the shortest shielding contact≤20mΩ;
Insulation resistance -
normal temp≥1000 MΩ (250V DC);
heat and humid≥20 MΩ (250V DC);
Insulation housing - LCP
Contacts - copper alloy, part gold plating, nickel plating
Mechanical life - 250 cycles
Vibration -
sine vibration: 10 ~2000Hz,147m/s2
random vibration: RMS 5.2G
Shock - 30g
Salt spray - 48h
Fireproof - UL94 V0