Insulation type high thermal conductive sheet resistant to bending and cracking
HEATEX™ has vertically oriented thermally conductive fillers with high thermal conductivity. Above mentioned filler, which contains boron nitride has been used in the insulation series.
It can be used as an interface (TIM) to efficiently transfer the heat from heat-generating parts (CPU,LED backlight, power chip) to cooling parts (heat sink, so on..).
Features
1. Lineup of insulation series.
2. High thermal conductivity, one of the highest in the market.
3. A rubber type soft sheet TIM without stickiness.*
Vertical orientation control of thermal conductive filler
Electron micrograph of the cross-sectional structure of an insulation series with vertically oriented boron nitride
Handling
Because of using silicone rubber, it is hard to break even when bent, has a silky feel, and has excellent workability.
Rework is also possible.
Adhesive treatment of the sheet surface is available as an option.
Thermal stability
Maintains low thermal resistance in pressurized environments.
Even if it is used for a long time in a harsh environment of 200°C, there is almost no change in physical properties.
In addition, the pump-out phenomenon caused by thermal paste is less likely to occur.
*Pump-out phenomenon
Materials that come into contact with grease undergo a pump-out phenomenon in which grease is discharged by repeating expansion and contraction as the temperature rises and falls.
When the pump-out phenomenon occurs, the contact thermal resistance increases due to the generation of void, and the initial performance cannot be obtained.