The model SE102 is a pressure sensor die of high overload pressure (HOP), i.e., high proof pressure and high burst pressure, which is based on piezoresistive working principle. The HOP sensor die is manufactured by the 6″ silicone micro-machining process, and it features silicon-on-silicon structure. Thanks to the unique design of its pressure diaphragm, the SE102 possesses both high sensitivity and extraordinary overload pressures.
This model is designed for absolute, gauge or differential pressure measurements. For gauge or differential pressure reference, there are two types of structure available. One is the silicon-on-silicon structure, i.e., with the silicon constraint, while the other is without the silicon constraint.
As a non-signal-conditioning sensor die, the standard SE102 is available in an open-bridge circuit with five solder pads for both bridge adjustment and temperature compensation.
Before packing, each SE102 sensor die is individually tested and qualified to its specifications.
Three types of packaging are available as options to fit different marketing demands.