Fully-automatic die bonder Esec 2009 fSE

The Esec 2009 fSE is the fastest soft solder die bonder in the industry with a broad application range. First to mention the point-to-line pick & place with stationary indexer, which enables increased throughput and productivity. Key Features Highest Productivity • High throughput up to 8,000 UPH • Best-in-class process control • High speed point-to-line pick & place • High speed X-shuttle Extended Application Range • Wide range of SOT, TO and DPAK packages • Single row and matrix leadframes • Dual die capability • Flying header / fullpack • Leadframe conversioh kits • Full range 8" wafer capability Fastest Time to Yield • Fast and easy setup • Auto teach function • Process visualisation • Solder pattern technology • Superior service & process support Low Operating Costs • Maximum reduction of material cost • Lowest gas consumption