A key to single device traceability - Get ready for the next level of inkless production. IC’s are getting more and more complex, denser, smaller and quality critical with one little lack. By just looking at them you cannot recognize if they are usable or not. That’s where Substrate Mapping E142 comes into play. E142 applies a virtual map like representation of the physical world to a lot of common substrate such as e.g. wafers, strips and trays. Besi Switzerland did implement Strip Mapping based on E142 on the Esec Die Bonder 2100.
Strip Identification
Able to read 2D DataMatrix down to 100 µm dots
Able to read CODE39 barcode down to 200 µm bars
Preferred StripID location: Near leading or trailing edge
SEMI E142 compliant strip mapping structure
E142.2 SECS II compliant communication
Configurable strip map download and upload
BinCodeMap generation configurable
TransferMap generation configurable
Wafer mapping via Stream12 still available