Flip-chip die bonder Datacon 8800 TC advanced

for die-attachthermalhigh-accuracy

Thermo Compression bonding is the key technology for current 2.5D/3D C2S and C2W packaging, with TC-CUF as the currently established process for 3D memory applications. The Datacon 8800 TC advanced sets the new benchmark based on the proven 8800 concept with total process control, advanced capabilities and unsurpassed production stability. With its unique and complete new Advanced Hardware architecture, unique 7-Axis Bond head and Advanced Process capabilities, the Datacon 8800 TC advanced is the essential tool of reference of current TSV applications. The Datacon 8800 TC advanced: • Ultra Fine Pitch Capability • Enhanced Thermo Compression Bond Control • 7-Axis Bond Head • Highest Productivity on Smallest Footprint Key Features Next Generation Control Platform • New motion control - New hardware & software • Enhanced trajectory control - Reduced latency times • More computing power - Process variable tracing      7-Axis / 250N Bond Head • 3 Actuators for positioning - X, Y, Theta • 2 Axes for bond control - Z, W • 2 Actuators for auto tilt setup - A, B    Advanced TC-CUF Yield Control • Yield and down-time prevention caused by flux • Trajectory controlled heating and cooling • New thermal stress resistant tool holder - Tilt • Accurate temperature calibration station    Optimized Tool Holder & Tool Hardware • New tool holder design - Special improved electrical contact mechanism • Fast maintenance • New tool design - Improved heater temperature accuracy and optimized electrical contact material