Flip-chip die bonder Esec 2100 FC hS

for die-attachautomatedhigh-accuracy

The Flip Chip Bonder Esec 2100 FC hS is the 3rd generation of the market leading High Speed FC platform, capable of running an extensive range of FC applications such as FCOL, FC‑MIS, FC‑SIP, FCCSP, FCBGA as well as emerging packages such as CSP-LED. It is the most effortless system to run, assist and control production, resulting in a quantum leap in throughput and yield at the lowest cost of ownership. Key Features Highest Speed at 8 µm Accuracy • Up to 12k UPH including dip fluxing • Very short pick & place cycle time due to the revolutionary Phi-Y concept combining rotational and linear movements • New "light&rigid" pick & place structure, advanced trajectory control as well as a liquid cooling system ensuring excellent accuracy at highest speed     Leading Edge Machine Concept • Real time process monitoring through 4 live images of process zone • Constant status control with real time wafer, strip and magazine viewer • Efficient learning and error recovery thanks to context sensitive online help Highest Up Time • Real time process monitoring through 4 live images of process zones • Constant status control with real time wafer, strip and magazine viewer • Efficient learning and error recovery thanks to context sensitive online help Fastest time to Yield • Tool-less exchange of product specific parts for fastest product changeovers • Teach and setup wizards and parameter teach verification eliminate setup errors • Recipe transfer from machine to machine enables fast conversion     The Platform of the Future • New controller hardware using Gigabit Ethernet communication enabling advanced processes